FR2079416B3 - - Google Patents

Info

Publication number
FR2079416B3
FR2079416B3 FR7104755A FR7104755A FR2079416B3 FR 2079416 B3 FR2079416 B3 FR 2079416B3 FR 7104755 A FR7104755 A FR 7104755A FR 7104755 A FR7104755 A FR 7104755A FR 2079416 B3 FR2079416 B3 FR 2079416B3
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7104755A
Other languages
French (fr)
Other versions
FR2079416A3 (en:Method
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of FR2079416A3 publication Critical patent/FR2079416A3/fr
Application granted granted Critical
Publication of FR2079416B3 publication Critical patent/FR2079416B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • H10W70/479—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
FR7104755A 1970-02-13 1971-02-12 Expired FR2079416B3 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1122570A 1970-02-13 1970-02-13

Publications (2)

Publication Number Publication Date
FR2079416A3 FR2079416A3 (en:Method) 1971-11-12
FR2079416B3 true FR2079416B3 (en:Method) 1973-10-19

Family

ID=21749402

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7104755A Expired FR2079416B3 (en:Method) 1970-02-13 1971-02-12

Country Status (6)

Country Link
US (1) US3676922A (en:Method)
AU (1) AU2457071A (en:Method)
DE (1) DE2105550A1 (en:Method)
FR (1) FR2079416B3 (en:Method)
GB (1) GB1286223A (en:Method)
NL (1) NL7101611A (en:Method)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444881A (en) * 1977-09-16 1979-04-09 Nec Corp Electrode wiring structure of integrated circuit
US4609936A (en) * 1979-09-19 1986-09-02 Motorola, Inc. Semiconductor chip with direct-bonded external leadframe
US4402450A (en) * 1981-08-21 1983-09-06 Western Electric Company, Inc. Adapting contacts for connection thereto
US5063432A (en) * 1989-05-22 1991-11-05 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
US6571468B1 (en) * 2001-02-26 2003-06-03 Saturn Electronics & Engineering, Inc. Traceless flip chip assembly and method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device

Also Published As

Publication number Publication date
US3676922A (en) 1972-07-18
NL7101611A (en:Method) 1971-08-17
GB1286223A (en) 1972-08-23
AU2457071A (en) 1972-07-27
DE2105550A1 (de) 1971-08-26
FR2079416A3 (en:Method) 1971-11-12

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Legal Events

Date Code Title Description
ST Notification of lapse