FR2061787A1 - - Google Patents

Info

Publication number
FR2061787A1
FR2061787A1 FR7033751A FR7033751A FR2061787A1 FR 2061787 A1 FR2061787 A1 FR 2061787A1 FR 7033751 A FR7033751 A FR 7033751A FR 7033751 A FR7033751 A FR 7033751A FR 2061787 A1 FR2061787 A1 FR 2061787A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7033751A
Other languages
French (fr)
Other versions
FR2061787B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Publication of FR2061787A1 publication Critical patent/FR2061787A1/fr
Application granted granted Critical
Publication of FR2061787B1 publication Critical patent/FR2061787B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Multi-Conductor Connections (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
FR7033751A 1969-09-18 1970-09-17 Expired FR2061787B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US85892369A 1969-09-18 1969-09-18

Publications (2)

Publication Number Publication Date
FR2061787A1 true FR2061787A1 (enExample) 1971-06-25
FR2061787B1 FR2061787B1 (enExample) 1974-09-20

Family

ID=25329509

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7033751A Expired FR2061787B1 (enExample) 1969-09-18 1970-09-17

Country Status (4)

Country Link
US (1) US3649274A (enExample)
DE (1) DE2045830A1 (enExample)
FR (1) FR2061787B1 (enExample)
GB (1) GB1282371A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2206653A1 (enExample) * 1972-11-14 1974-06-07 Cii

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833375A (en) * 1972-03-09 1974-09-03 Rca Corp Method of repairing an imperfect pattern of metalized portions on a substrate
US3965277A (en) * 1972-05-09 1976-06-22 Massachusetts Institute Of Technology Photoformed plated interconnection of embedded integrated circuit chips
DE3279915D1 (en) * 1981-12-11 1989-10-05 Western Electric Co Circuit board fabrication leading to increased capacity
US4888450A (en) * 1981-12-11 1989-12-19 At&T Bell Laboratories Circuit board fabrication leading to increased capacity
US4775611A (en) * 1983-11-10 1988-10-04 Sullivan Donald F Additive printed circuit boards with flat surface and indented primary wiring conductors
DE3570931D1 (en) * 1984-08-10 1989-07-13 Siemens Ag Thermostable polymer system, cross-linkable by irradiation, for microelectronic use
US4876322A (en) * 1984-08-10 1989-10-24 Siemens Aktiengesselschaft Irradiation cross-linkable thermostable polymer system, for microelectronic applications
US4647882A (en) * 1984-11-14 1987-03-03 Itt Corporation Miniature microwave guide
US4673904A (en) * 1984-11-14 1987-06-16 Itt Corporation Micro-coaxial substrate
US4647878A (en) * 1984-11-14 1987-03-03 Itt Corporation Coaxial shielded directional microwave coupler
CA2029244A1 (en) * 1989-11-03 1991-05-04 Timothy L. Hoopman Planarizing surfaces of interconnect substrates by diamond turning
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
US5363550A (en) * 1992-12-23 1994-11-15 International Business Machines Corporation Method of Fabricating a micro-coaxial wiring structure
US5545510A (en) * 1995-03-28 1996-08-13 Mac Dermid, Inc. Photodefinable dielectric composition useful in the manufacture of printed circuits
US5789142A (en) * 1996-01-16 1998-08-04 Motorola, Inc. Solder mask system
FI106585B (fi) * 1997-10-22 2001-02-28 Nokia Mobile Phones Ltd Koaksiaalijohto, menetelmä koaksiaalijohdon valmistamiseksi ja langaton viestin
US6387810B2 (en) * 1999-06-28 2002-05-14 International Business Machines Corporation Method for homogenizing device parameters through photoresist planarization
EP1940989B1 (en) * 2005-09-29 2010-12-15 Dow Corning Corporation Method of releasing high temperature films and/or devices from metallic substrates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3351953A (en) * 1966-03-10 1967-11-07 Bunker Ramo Interconnection means and method of fabrication thereof
US3391454A (en) * 1965-03-10 1968-07-09 Litton Systems Inc Shielded etched circuit conductor
FR1597601A (enExample) * 1967-11-06 1970-06-29

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL190034A (enExample) * 1953-08-17
US3042591A (en) * 1957-05-20 1962-07-03 Motorola Inc Process for forming electrical conductors on insulating bases
US3366519A (en) * 1964-01-20 1968-01-30 Texas Instruments Inc Process for manufacturing multilayer film circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391454A (en) * 1965-03-10 1968-07-09 Litton Systems Inc Shielded etched circuit conductor
US3351953A (en) * 1966-03-10 1967-11-07 Bunker Ramo Interconnection means and method of fabrication thereof
FR1597601A (enExample) * 1967-11-06 1970-06-29

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
(REVUE AMERICAINE IBM TECHNICAL DISCLOSURE BULLETIN"VOLUME 11,NO.10,MARS PAGE 1320,ARTICLE:" MULTILYER CIRCUIR"DE F.W.HAINING.) *
MULTILYER CIRCUIR"DE F.W.HAINING.) *
REVUE AMERICAINE IBM TECHNICAL DISCLOSURE BULLETIN"VOLUME 11,NO.10,MARS PAGE 1320,ARTICLE:" *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2206653A1 (enExample) * 1972-11-14 1974-06-07 Cii

Also Published As

Publication number Publication date
US3649274A (en) 1972-03-14
GB1282371A (en) 1972-07-19
DE2045830A1 (de) 1971-03-25
FR2061787B1 (enExample) 1974-09-20

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Legal Events

Date Code Title Description
ST Notification of lapse