FR2021545A1 - - Google Patents

Info

Publication number
FR2021545A1
FR2021545A1 FR6936178A FR6936178A FR2021545A1 FR 2021545 A1 FR2021545 A1 FR 2021545A1 FR 6936178 A FR6936178 A FR 6936178A FR 6936178 A FR6936178 A FR 6936178A FR 2021545 A1 FR2021545 A1 FR 2021545A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR6936178A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Switzerland
Original Assignee
BBC BROWN BOVERI and CIE
Brown Boveri und Cie AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, Brown Boveri und Cie AG Switzerland filed Critical BBC BROWN BOVERI and CIE
Publication of FR2021545A1 publication Critical patent/FR2021545A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR6936178A 1968-10-25 1969-10-22 Withdrawn FR2021545A1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1596568A CH477092A (de) 1968-10-25 1968-10-25 Verfahren zur Herstellung eines Kühlkörpers

Publications (1)

Publication Number Publication Date
FR2021545A1 true FR2021545A1 (enExample) 1970-07-24

Family

ID=4413408

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6936178A Withdrawn FR2021545A1 (enExample) 1968-10-25 1969-10-22

Country Status (4)

Country Link
CH (1) CH477092A (enExample)
DE (2) DE1810006A1 (enExample)
FR (1) FR2021545A1 (enExample)
GB (1) GB1290506A (enExample)

Also Published As

Publication number Publication date
GB1290506A (enExample) 1972-09-27
DE6807850U (de) 1970-10-08
CH477092A (de) 1969-08-15
DE1810006A1 (de) 1970-05-21

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Legal Events

Date Code Title Description
ST Notification of lapse