FR1599501A - - Google Patents
Info
- Publication number
- FR1599501A FR1599501A FR1599501DA FR1599501A FR 1599501 A FR1599501 A FR 1599501A FR 1599501D A FR1599501D A FR 1599501DA FR 1599501 A FR1599501 A FR 1599501A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69586068A | 1968-01-05 | 1968-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1599501A true FR1599501A (es) | 1970-07-15 |
Family
ID=24794740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1599501D Expired FR1599501A (es) | 1968-01-05 | 1968-12-30 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3475186A (es) |
| BE (1) | BE726182A (es) |
| DE (1) | DE1900442B2 (es) |
| FR (1) | FR1599501A (es) |
| GB (1) | GB1195330A (es) |
| NL (1) | NL139095B (es) |
| SE (1) | SE345144B (es) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615735A (en) * | 1968-08-13 | 1971-10-26 | Shipley Co | Electroless copper plating |
| US3615733A (en) * | 1968-08-13 | 1971-10-26 | Shipley Co | Electroless copper plating |
| US3765936A (en) * | 1968-08-13 | 1973-10-16 | Shipley Co | Electroless copper plate |
| US3978252A (en) * | 1973-03-23 | 1976-08-31 | Macdermid Incorporated | Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon |
| US4167601A (en) * | 1976-11-15 | 1979-09-11 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
| US4228213A (en) * | 1979-08-13 | 1980-10-14 | Western Electric Company, Inc. | Method of depositing a stress-free electroless copper deposit |
| DE3473890D1 (en) * | 1983-07-25 | 1988-10-13 | Hitachi Ltd | Electroless copper plating solution |
| US4969842A (en) * | 1989-11-30 | 1990-11-13 | Amp Incorporated | Molded electrical connector having integral spring contact beams |
| US20090206526A1 (en) | 2008-02-18 | 2009-08-20 | Huntsman Petrochemical Corporation | Sintering aids |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
| GB1089317A (en) * | 1965-06-19 | 1967-11-01 | Asahi Dow Ltd | An electroless copper plating bath |
-
1968
- 1968-01-05 US US695860A patent/US3475186A/en not_active Expired - Lifetime
- 1968-12-11 GB GB58920/68A patent/GB1195330A/en not_active Expired
- 1968-12-27 BE BE726182D patent/BE726182A/xx unknown
- 1968-12-30 FR FR1599501D patent/FR1599501A/fr not_active Expired
-
1969
- 1969-01-02 SE SE26/69A patent/SE345144B/xx unknown
- 1969-01-03 NL NL696900088A patent/NL139095B/xx unknown
- 1969-01-04 DE DE19691900442 patent/DE1900442B2/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| GB1195330A (en) | 1970-06-17 |
| NL6900088A (es) | 1969-07-08 |
| US3475186A (en) | 1969-10-28 |
| BE726182A (es) | 1969-06-27 |
| SE345144B (es) | 1972-05-15 |
| DE1900442A1 (de) | 1969-11-20 |
| NL139095B (nl) | 1973-06-15 |
| DE1900442B2 (de) | 1971-09-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |