FR1582250A - - Google Patents

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Publication number
FR1582250A
FR1582250A FR1582250DA FR1582250A FR 1582250 A FR1582250 A FR 1582250A FR 1582250D A FR1582250D A FR 1582250DA FR 1582250 A FR1582250 A FR 1582250A
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FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
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Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1582250A publication Critical patent/FR1582250A/fr
Expired legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • HELECTRICITY
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
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    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/66High-frequency adaptations
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6644Packaging aspects of high-frequency amplifiers
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49109Connecting at different heights outside the semiconductor or solid-state body
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01005Boron [B]
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    • H01L2924/01006Carbon [C]
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    • H01L2924/01015Phosphorus [P]
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    • H01L2924/01019Potassium [K]
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    • H01L2924/01023Vanadium [V]
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    • H01L2924/01027Cobalt [Co]
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    • H01L2924/01028Nickel [Ni]
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    • H01L2924/01039Yttrium [Y]
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    • H01L2924/01042Molybdenum [Mo]
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    • H01L2924/013Alloys
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    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
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    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
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    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30105Capacitance
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    • H01L2924/30107Inductance
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    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Bipolar Transistors (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR1582250D 1967-08-30 1968-08-27 Expired FR1582250A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DET0034676 1967-08-30
DE1614858A DE1614858C3 (de) 1967-08-30 1967-08-30 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
FR1582250A true FR1582250A (fr) 1969-09-26

Family

ID=25753718

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1582250D Expired FR1582250A (fr) 1967-08-30 1968-08-27

Country Status (4)

Country Link
US (1) US3609480A (fr)
DE (1) DE1614858C3 (fr)
FR (1) FR1582250A (fr)
GB (1) GB1244023A (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2087673A5 (fr) * 1970-05-27 1971-12-31 Comp Generale Electricite
US3694902A (en) * 1970-08-31 1972-10-03 Bell Telephone Labor Inc Electroluminescent display apparatus
JPS5752916Y2 (fr) * 1976-03-02 1982-11-17
US4266090A (en) * 1978-09-14 1981-05-05 Isotronics, Incorporated All metal flat package
GB2132413A (en) * 1982-12-24 1984-07-04 Plessey Co Plc Microwave device package
US5737580A (en) * 1995-04-28 1998-04-07 International Business Machines Corporation Wiring design tool improvement for avoiding electromigration by determining optimal wire widths
US10912185B2 (en) 2015-06-22 2021-02-02 Telefonaktiebolaget Lm Ericsson (Publ) Low-cost superior performance coinless RF power amplifier
CN107771416B (zh) * 2015-06-22 2021-05-28 瑞典爱立信有限公司 用于无埋块的rf功率放大器的滑动和安装制造

Also Published As

Publication number Publication date
DE1614858B2 (de) 1975-02-13
DE1614858C3 (de) 1975-09-18
DE1614858A1 (de) 1970-12-23
US3609480A (en) 1971-09-28
GB1244023A (en) 1971-08-25

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ST Notification of lapse