FR1571037A - - Google Patents

Info

Publication number
FR1571037A
FR1571037A FR1571037DA FR1571037A FR 1571037 A FR1571037 A FR 1571037A FR 1571037D A FR1571037D A FR 1571037DA FR 1571037 A FR1571037 A FR 1571037A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1571037A publication Critical patent/FR1571037A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53061—Responsive to work or work-related machine element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
FR1571037D 1967-06-26 1968-06-04 Expired FR1571037A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64870467A 1967-06-26 1967-06-26

Publications (1)

Publication Number Publication Date
FR1571037A true FR1571037A (enExample) 1969-06-13

Family

ID=24601885

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1571037D Expired FR1571037A (enExample) 1967-06-26 1968-06-04

Country Status (3)

Country Link
US (1) US3475805A (enExample)
FR (1) FR1571037A (enExample)
GB (1) GB1218856A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0011020A1 (fr) * 1978-10-31 1980-05-14 Societe D'etudes Recherches Et Constructions Electroniques Sercel Dispositif d'ajustement de la position d'une pièce entre deux butées

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1239749A (enExample) * 1967-09-13 1971-07-21
US3597824A (en) * 1968-03-19 1971-08-10 Matsushita Electric Industrial Co Ltd Full-automatic electric part mounting apparatus
US3604099A (en) * 1969-08-18 1971-09-14 Western Electric Co Methods of and apparatus for bonding leaded devices to substrates
BE790855A (fr) * 1971-11-18 1973-02-15 Commissariat Energie Atomique Procede d'encapsulage semi-automatique et appareil semi-automatique a encapsuler
US3796497A (en) * 1971-12-01 1974-03-12 Ibm Optical alignment method and apparatus
US3958740A (en) * 1974-07-08 1976-05-25 Dixon Automation, Inc. Automatic component assembly machine and method relating thereto
US3946931A (en) * 1974-11-27 1976-03-30 Western Electric Company, Inc. Methods of and apparatus for bonding an article to a substrate
NL8001114A (nl) * 1980-02-25 1981-09-16 Philips Nv Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.
US4372802A (en) * 1980-06-02 1983-02-08 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on printed circuit boards
US4461610A (en) * 1980-06-02 1984-07-24 Tdk Corporation Apparatus for mounting chip type circuit elements on printed circuit boards
DE3044554A1 (de) 1980-11-26 1982-06-24 Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar Verfahren und anordnung zur pruefung der uebereinstimmung von visier- und ziellinien
US4460421A (en) * 1982-11-29 1984-07-17 At&T Technologies, Inc. Methods of and apparatus for indexing a repetitively patterned strip past a plurality of work stations
DE3474750D1 (en) * 1983-11-05 1988-11-24 Zevatech Ag Method and device positioning elements on a work piece
KR0169812B1 (ko) * 1995-12-30 1999-01-15 김광호 개별 패키지 소자 적층 및 솔더링 장치
US6506614B1 (en) 2002-01-29 2003-01-14 Tyco Electronics Corporation Method of locating and placing eye point features of a semiconductor die on a substrate
DE112006002529T5 (de) * 2005-09-23 2008-08-14 Delta Design, Inc., Poway Dreipunkt-Sicht-Ausrichtsystem mit einer einzigen Kamera für ein Vorrichtungs-Handhabungsgerät
US8550523B2 (en) * 2007-06-22 2013-10-08 Data I/O Corporation Pick and place system
US7842912B2 (en) * 2008-05-23 2010-11-30 Delta Design, Inc. Camera based vision alignment with device group guiding for semiconductor device testing handlers
US8106349B2 (en) * 2008-07-16 2012-01-31 Delta Design, Inc. Vision alignment with multiple cameras and common coordinate at contactor for IC device testing handlers
US20110010122A1 (en) * 2009-07-07 2011-01-13 Delta Design, Inc. Calibrating separately located cameras with a double sided visible calibration target for ic device testing handlers
CN116652580B (zh) * 2023-06-06 2026-02-27 苏州迪克微电子有限公司 一种面向ate弹簧探针预组装的闸门结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198311A (en) * 1962-09-24 1965-08-03 Western Electric Co Apparatus for transferring and orienting articles
GB1114393A (en) * 1964-12-23 1968-05-22 Ibm Improvements in or relating to apparatus for sensing the orientation of an object
US3312325A (en) * 1965-05-27 1967-04-04 Ibm Chip orientor
US3344900A (en) * 1965-05-27 1967-10-03 Ibm Chip orienting control circuit for a chip positioning machine
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0011020A1 (fr) * 1978-10-31 1980-05-14 Societe D'etudes Recherches Et Constructions Electroniques Sercel Dispositif d'ajustement de la position d'une pièce entre deux butées
FR2440256A1 (fr) * 1978-10-31 1980-05-30 Sercel Rech Const Elect Ajustement automatique de la position d'une piece entre deux butees

Also Published As

Publication number Publication date
DE1766619B2 (de) 1976-05-26
DE1766619A1 (de) 1971-11-25
GB1218856A (en) 1971-01-13
US3475805A (en) 1969-11-04

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Legal Events

Date Code Title Description
ST Notification of lapse