FR1569176A - - Google Patents
Info
- Publication number
- FR1569176A FR1569176A FR1569176DA FR1569176A FR 1569176 A FR1569176 A FR 1569176A FR 1569176D A FR1569176D A FR 1569176DA FR 1569176 A FR1569176 A FR 1569176A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D51/00—Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular parts; Carrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends
- B23D51/04—Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular parts; Carrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends of devices for feeding, positioning, clamping, or rotating work
- B23D51/046—Sawing machines or sawing devices working with straight blades, characterised only by constructional features of particular parts; Carrying or attaching means for tools, covered by this subclass, which are connected to a carrier at both ends of devices for feeding, positioning, clamping, or rotating work for feeding work into engagement with the saw blade, e.g. rotating work while sawing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEV0035040 | 1967-12-18 | ||
FR153298 | 1968-05-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1569176A true FR1569176A (ja) | 1969-05-30 |
Family
ID=26002076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1569176D Expired FR1569176A (ja) | 1967-12-18 | 1968-05-29 |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1652228A1 (ja) |
FR (1) | FR1569176A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2401753A1 (fr) * | 1977-08-31 | 1979-03-30 | Wacker Chemitronic | Dispositif et procede d'usinage de pieces par abrasion |
US6021772A (en) * | 1997-03-21 | 2000-02-08 | Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag | Bandsaw and process for cutting off slices from a workpiece |
WO2011032553A1 (de) * | 2009-09-09 | 2011-03-24 | HK Präzisionstechnik GmbH | Verfahren und trennsystem mit vorrichtung zum trennenden bearbeiten von kristallinen materialien sowie deren verwendung |
-
1967
- 1967-12-18 DE DE19671652228 patent/DE1652228A1/de active Pending
-
1968
- 1968-05-29 FR FR1569176D patent/FR1569176A/fr not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2401753A1 (fr) * | 1977-08-31 | 1979-03-30 | Wacker Chemitronic | Dispositif et procede d'usinage de pieces par abrasion |
US6021772A (en) * | 1997-03-21 | 2000-02-08 | Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag | Bandsaw and process for cutting off slices from a workpiece |
WO2011032553A1 (de) * | 2009-09-09 | 2011-03-24 | HK Präzisionstechnik GmbH | Verfahren und trennsystem mit vorrichtung zum trennenden bearbeiten von kristallinen materialien sowie deren verwendung |
Also Published As
Publication number | Publication date |
---|---|
DE1652228A1 (de) | 1971-03-11 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |