FR1562691A - - Google Patents

Info

Publication number
FR1562691A
FR1562691A FR1562691DA FR1562691A FR 1562691 A FR1562691 A FR 1562691A FR 1562691D A FR1562691D A FR 1562691DA FR 1562691 A FR1562691 A FR 1562691A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1562691A publication Critical patent/FR1562691A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
FR1562691D 1967-05-15 1968-05-14 Expired FR1562691A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US63851067A 1967-05-15 1967-05-15

Publications (1)

Publication Number Publication Date
FR1562691A true FR1562691A (fr) 1969-04-04

Family

ID=24560337

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1562691D Expired FR1562691A (fr) 1967-05-15 1968-05-14

Country Status (3)

Country Link
US (1) US3457988A (fr)
FR (1) FR1562691A (fr)
GB (1) GB1172648A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0669651A1 (fr) * 1994-02-28 1995-08-30 AT&T Corp. Procédé et appareil pour refroidir des composants électroniques

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56122149A (en) * 1980-02-29 1981-09-25 Fujitsu Ltd Heat dissipating structure for semiconductor device
JPS58169943A (ja) * 1982-03-29 1983-10-06 Fujitsu Ltd 半導体装置
US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4489363A (en) * 1983-01-31 1984-12-18 Sperry Corporation Apparatus for cooling integrated circuit chips
DE3703873A1 (de) * 1987-02-07 1988-08-18 Sueddeutsche Kuehler Behr Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente
KR970000281B1 (ko) * 1991-12-30 1997-01-08 엘지전자 주식회사 마그네트론의 냉각핀
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
US5773886A (en) * 1993-07-15 1998-06-30 Lsi Logic Corporation System having stackable heat sink structures
US5654587A (en) * 1993-07-15 1997-08-05 Lsi Logic Corporation Stackable heatsink structure for semiconductor devices
US5693981A (en) * 1993-12-14 1997-12-02 Lsi Logic Corporation Electronic system with heat dissipating apparatus and method of dissipating heat in an electronic system
US5514327A (en) * 1993-12-14 1996-05-07 Lsi Logic Corporation Powder metal heat sink for integrated circuit devices
SE506348C2 (sv) * 1996-04-01 1997-12-08 Tetra Laval Holdings & Finance Förpackningsmaterialbana för en självbärande förpackningsbehållarvägg jämte av banan tillverkad förpackningsbehållare
US5957194A (en) 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
JP3417310B2 (ja) * 1998-08-31 2003-06-16 株式会社デンソー プレートフィン型熱交換器及びその製造方法
US6308771B1 (en) 1998-10-29 2001-10-30 Advanced Thermal Solutions, Inc. High performance fan tail heat exchanger
US6301779B1 (en) 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
US6199625B1 (en) 1999-06-11 2001-03-13 Psc Computer Products, Inc. Stackable heat sink for electronic components
US6360816B1 (en) * 1999-12-23 2002-03-26 Agilent Technologies, Inc. Cooling apparatus for electronic devices
US6681842B2 (en) * 2001-12-03 2004-01-27 Agilent Technologies, Inc. Cooling apparatus
US6712128B1 (en) * 2002-11-20 2004-03-30 Thermal Corp. Cylindrical fin tower heat sink and heat exchanger
US20040227606A1 (en) * 2003-04-22 2004-11-18 Phoenixtec Power Co. , Ltd. Stacked cores and the heat dissipation method for the same
CN2676128Y (zh) * 2003-12-11 2005-02-02 东莞莫仕连接器有限公司 导热装置
US7497248B2 (en) * 2004-04-30 2009-03-03 Hewlett-Packard Development Company, L.P. Twin fin arrayed cooling device
DE102004050588B4 (de) * 2004-10-16 2009-05-20 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleiterbauelement und mit einer Kontakteinrichtung
DE102004058946B4 (de) * 2004-12-08 2009-06-18 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Hilfsanschluss
TWI274539B (en) * 2005-04-01 2007-02-21 Delta Electronics Inc Heat dissipating assembly with composite heat dissipating structure
US20090038776A1 (en) * 2007-08-10 2009-02-12 Tsung-Hsien Huang Cooler module
US7845393B2 (en) * 2007-11-06 2010-12-07 Jiing Tung Tec. Metal Co., Ltd. Thermal module
US20090159254A1 (en) * 2007-12-19 2009-06-25 Tyco Electronics Corporation Heat sink assembly and method of fabricating
US9718447B2 (en) * 2009-02-02 2017-08-01 Goodrich Corporation Thermal management composite heat shield
KR20130019076A (ko) * 2011-08-16 2013-02-26 엘에스산전 주식회사 방열판
US20130056186A1 (en) 2011-09-06 2013-03-07 Carl Schalansky Heat exchanger produced from laminar elements
US11774187B2 (en) * 2018-04-19 2023-10-03 Kyungdong Navien Co., Ltd. Heat transfer fin of fin-tube type heat exchanger

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1966559A (en) * 1930-11-22 1934-07-17 Olson John Otto Heat exchanger
US2063736A (en) * 1935-03-08 1936-12-08 Gen Motors Corp Heat exchanger
US2428145A (en) * 1944-09-11 1947-09-30 Pacific Metals Company Ltd Heat transfer fin
US3277957A (en) * 1964-04-03 1966-10-11 Westinghouse Electric Corp Heat transfer apparatus for electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0669651A1 (fr) * 1994-02-28 1995-08-30 AT&T Corp. Procédé et appareil pour refroidir des composants électroniques

Also Published As

Publication number Publication date
GB1172648A (en) 1969-12-03
US3457988A (en) 1969-07-29

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Legal Events

Date Code Title Description
ST Notification of lapse