FR1542642A - Semiconductor mounting - Google Patents
Semiconductor mountingInfo
- Publication number
- FR1542642A FR1542642A FR117557A FR117557A FR1542642A FR 1542642 A FR1542642 A FR 1542642A FR 117557 A FR117557 A FR 117557A FR 117557 A FR117557 A FR 117557A FR 1542642 A FR1542642 A FR 1542642A
- Authority
- FR
- France
- Prior art keywords
- semiconductor mounting
- semiconductor
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53242—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being a noble metal, e.g. gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR117557A FR1542642A (en) | 1966-08-30 | 1967-08-10 | Semiconductor mounting |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1521057A DE1521057C3 (en) | 1966-08-30 | 1966-08-30 | Method for contacting a semiconductor zone |
FR117557A FR1542642A (en) | 1966-08-30 | 1967-08-10 | Semiconductor mounting |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1542642A true FR1542642A (en) | 1968-10-18 |
Family
ID=26000221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR117557A Expired FR1542642A (en) | 1966-08-30 | 1967-08-10 | Semiconductor mounting |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1542642A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2154619A1 (en) * | 1971-09-29 | 1973-05-11 | Siemens Ag | |
CN114150314A (en) * | 2021-11-23 | 2022-03-08 | 中国航发北京航空材料研究院 | High-corrosion-resistance composite silver layer and preparation process thereof |
-
1967
- 1967-08-10 FR FR117557A patent/FR1542642A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2154619A1 (en) * | 1971-09-29 | 1973-05-11 | Siemens Ag | |
CN114150314A (en) * | 2021-11-23 | 2022-03-08 | 中国航发北京航空材料研究院 | High-corrosion-resistance composite silver layer and preparation process thereof |
CN114150314B (en) * | 2021-11-23 | 2024-02-13 | 中国航发北京航空材料研究院 | High corrosion-resistant composite silver layer and preparation process thereof |
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