FR1535282A - Cooling body for semiconductor building elements - Google Patents

Cooling body for semiconductor building elements

Info

Publication number
FR1535282A
FR1535282A FR119340A FR119340A FR1535282A FR 1535282 A FR1535282 A FR 1535282A FR 119340 A FR119340 A FR 119340A FR 119340 A FR119340 A FR 119340A FR 1535282 A FR1535282 A FR 1535282A
Authority
FR
France
Prior art keywords
cooling body
building elements
semiconductor building
semiconductor
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR119340A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C K D PRAHA OP
Original Assignee
C K D PRAHA OP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C K D PRAHA OP filed Critical C K D PRAHA OP
Priority to FR119340A priority Critical patent/FR1535282A/en
Application granted granted Critical
Publication of FR1535282A publication Critical patent/FR1535282A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR119340A 1966-08-29 1967-08-29 Cooling body for semiconductor building elements Expired FR1535282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR119340A FR1535282A (en) 1966-08-29 1967-08-29 Cooling body for semiconductor building elements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CS560566 1966-08-29
FR119340A FR1535282A (en) 1966-08-29 1967-08-29 Cooling body for semiconductor building elements

Publications (1)

Publication Number Publication Date
FR1535282A true FR1535282A (en) 1968-08-02

Family

ID=25746210

Family Applications (1)

Application Number Title Priority Date Filing Date
FR119340A Expired FR1535282A (en) 1966-08-29 1967-08-29 Cooling body for semiconductor building elements

Country Status (1)

Country Link
FR (1) FR1535282A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479564A1 (en) * 1980-03-26 1981-10-02 Thomson Csf ENCAPSULATION CASE FOR POWER MODULE IN HYBRID CIRCUIT

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479564A1 (en) * 1980-03-26 1981-10-02 Thomson Csf ENCAPSULATION CASE FOR POWER MODULE IN HYBRID CIRCUIT
EP0037301A2 (en) * 1980-03-26 1981-10-07 Thomson-Csf Encapsulating housing for hybrid circuit power module
EP0037301A3 (en) * 1980-03-26 1981-10-14 Thomson-Csf Encapsulating housing for hybrid circuit power module

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