FR1532026A - Method of manufacturing an electrical circuit assembly - Google Patents

Method of manufacturing an electrical circuit assembly

Info

Publication number
FR1532026A
FR1532026A FR115177A FR115177A FR1532026A FR 1532026 A FR1532026 A FR 1532026A FR 115177 A FR115177 A FR 115177A FR 115177 A FR115177 A FR 115177A FR 1532026 A FR1532026 A FR 1532026A
Authority
FR
France
Prior art keywords
manufacturing
electrical circuit
circuit assembly
assembly
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR115177A
Other languages
French (fr)
Inventor
David Boswell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Standard Electric Corp
Original Assignee
International Standard Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB33056/66A external-priority patent/GB1080618A/en
Application filed by International Standard Electric Corp filed Critical International Standard Electric Corp
Priority to FR115177A priority Critical patent/FR1532026A/en
Application granted granted Critical
Publication of FR1532026A publication Critical patent/FR1532026A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/12—Insulating of windings
    • H01F41/125—Other insulating structures; Insulating between coil and core, between different winding sections, around the coil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
FR115177A 1966-06-23 1967-07-21 Method of manufacturing an electrical circuit assembly Expired FR1532026A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR115177A FR1532026A (en) 1966-06-23 1967-07-21 Method of manufacturing an electrical circuit assembly

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEB0087686 1966-06-23
GB33056/66A GB1080618A (en) 1966-06-23 1966-07-22 Hybrid semiconductor circuits
FR115177A FR1532026A (en) 1966-06-23 1967-07-21 Method of manufacturing an electrical circuit assembly

Publications (1)

Publication Number Publication Date
FR1532026A true FR1532026A (en) 1968-07-05

Family

ID=27209364

Family Applications (1)

Application Number Title Priority Date Filing Date
FR115177A Expired FR1532026A (en) 1966-06-23 1967-07-21 Method of manufacturing an electrical circuit assembly

Country Status (1)

Country Link
FR (1) FR1532026A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479639A1 (en) * 1980-03-25 1981-10-02 Thomson Csf Electronic component mounting process for PCB - uses metal bridges in contact with metal tracks to permit substrate flexing without damage to solder joints
FR2486755A1 (en) * 1980-07-11 1982-01-15 Socapex SUPPORT FOR ELECTRONIC COMPONENTS FOR HIGH-DIMENSIONAL HYBRID CIRCUITS
EP1122782A2 (en) * 2000-01-31 2001-08-08 Visteon Global Technologies, Inc. Etched tri-layer metal with integrated wire traces for wire bonding

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479639A1 (en) * 1980-03-25 1981-10-02 Thomson Csf Electronic component mounting process for PCB - uses metal bridges in contact with metal tracks to permit substrate flexing without damage to solder joints
FR2486755A1 (en) * 1980-07-11 1982-01-15 Socapex SUPPORT FOR ELECTRONIC COMPONENTS FOR HIGH-DIMENSIONAL HYBRID CIRCUITS
EP0044247A1 (en) * 1980-07-11 1982-01-20 Socapex Method of producing a carrier for electronic components for the interconnection of integrated-circuit chips
EP1122782A2 (en) * 2000-01-31 2001-08-08 Visteon Global Technologies, Inc. Etched tri-layer metal with integrated wire traces for wire bonding
EP1122782A3 (en) * 2000-01-31 2004-01-02 Visteon Global Technologies, Inc. Etched tri-layer metal with integrated wire traces for wire bonding

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