FR1530167A - Composition and process for the electroless chemical deposition of copper on objects with a catalytic surface - Google Patents
Composition and process for the electroless chemical deposition of copper on objects with a catalytic surfaceInfo
- Publication number
- FR1530167A FR1530167A FR112901A FR112901A FR1530167A FR 1530167 A FR1530167 A FR 1530167A FR 112901 A FR112901 A FR 112901A FR 112901 A FR112901 A FR 112901A FR 1530167 A FR1530167 A FR 1530167A
- Authority
- FR
- France
- Prior art keywords
- copper
- objects
- composition
- chemical deposition
- catalytic surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR112901A FR1530167A (en) | 1967-07-03 | 1967-07-03 | Composition and process for the electroless chemical deposition of copper on objects with a catalytic surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR112901A FR1530167A (en) | 1967-07-03 | 1967-07-03 | Composition and process for the electroless chemical deposition of copper on objects with a catalytic surface |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1530167A true FR1530167A (en) | 1968-06-21 |
Family
ID=8634363
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR112901A Expired FR1530167A (en) | 1967-07-03 | 1967-07-03 | Composition and process for the electroless chemical deposition of copper on objects with a catalytic surface |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1530167A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0164580A2 (en) * | 1984-05-17 | 1985-12-18 | International Business Machines Corporation | Electroless copper plating bath and plating method using such bath |
-
1967
- 1967-07-03 FR FR112901A patent/FR1530167A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0164580A2 (en) * | 1984-05-17 | 1985-12-18 | International Business Machines Corporation | Electroless copper plating bath and plating method using such bath |
EP0164580A3 (en) * | 1984-05-17 | 1986-12-30 | International Business Machines Corporation | Electroless copper plating bath and plating method using such bath |
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