FR1528075A - Housing for a semiconductor device and its manufacturing process - Google Patents

Housing for a semiconductor device and its manufacturing process

Info

Publication number
FR1528075A
FR1528075A FR104639A FR104639A FR1528075A FR 1528075 A FR1528075 A FR 1528075A FR 104639 A FR104639 A FR 104639A FR 104639 A FR104639 A FR 104639A FR 1528075 A FR1528075 A FR 1528075A
Authority
FR
France
Prior art keywords
housing
semiconductor device
manufacturing process
manufacturing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR104639A
Other languages
French (fr)
Inventor
Yves Charles Suel
Henri Thouvenin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RADIOTECHNIQUE COPRIM RTC
Original Assignee
RADIOTECHNIQUE COPRIM RTC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RADIOTECHNIQUE COPRIM RTC filed Critical RADIOTECHNIQUE COPRIM RTC
Priority to FR104639A priority Critical patent/FR1528075A/en
Application granted granted Critical
Publication of FR1528075A publication Critical patent/FR1528075A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR104639A 1967-04-28 1967-04-28 Housing for a semiconductor device and its manufacturing process Expired FR1528075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR104639A FR1528075A (en) 1967-04-28 1967-04-28 Housing for a semiconductor device and its manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR104639A FR1528075A (en) 1967-04-28 1967-04-28 Housing for a semiconductor device and its manufacturing process

Publications (1)

Publication Number Publication Date
FR1528075A true FR1528075A (en) 1968-06-07

Family

ID=8629893

Family Applications (1)

Application Number Title Priority Date Filing Date
FR104639A Expired FR1528075A (en) 1967-04-28 1967-04-28 Housing for a semiconductor device and its manufacturing process

Country Status (1)

Country Link
FR (1) FR1528075A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445736A (en) * 1982-03-31 1984-05-01 Amp Incorporated Method and apparatus for producing a premolded packaging
US4547964A (en) * 1982-08-09 1985-10-22 Sony Corporation Method for the manufacture of a printed-circuit board connector
DE3430849A1 (en) * 1984-08-22 1986-03-06 Gerd 7742 St Georgen Kammerer Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4445736A (en) * 1982-03-31 1984-05-01 Amp Incorporated Method and apparatus for producing a premolded packaging
US4547964A (en) * 1982-08-09 1985-10-22 Sony Corporation Method for the manufacture of a printed-circuit board connector
DE3430849A1 (en) * 1984-08-22 1986-03-06 Gerd 7742 St Georgen Kammerer Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier

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