FR1528075A - Housing for a semiconductor device and its manufacturing process - Google Patents
Housing for a semiconductor device and its manufacturing processInfo
- Publication number
- FR1528075A FR1528075A FR104639A FR104639A FR1528075A FR 1528075 A FR1528075 A FR 1528075A FR 104639 A FR104639 A FR 104639A FR 104639 A FR104639 A FR 104639A FR 1528075 A FR1528075 A FR 1528075A
- Authority
- FR
- France
- Prior art keywords
- housing
- semiconductor device
- manufacturing process
- manufacturing
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR104639A FR1528075A (en) | 1967-04-28 | 1967-04-28 | Housing for a semiconductor device and its manufacturing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR104639A FR1528075A (en) | 1967-04-28 | 1967-04-28 | Housing for a semiconductor device and its manufacturing process |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1528075A true FR1528075A (en) | 1968-06-07 |
Family
ID=8629893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR104639A Expired FR1528075A (en) | 1967-04-28 | 1967-04-28 | Housing for a semiconductor device and its manufacturing process |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1528075A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445736A (en) * | 1982-03-31 | 1984-05-01 | Amp Incorporated | Method and apparatus for producing a premolded packaging |
US4547964A (en) * | 1982-08-09 | 1985-10-22 | Sony Corporation | Method for the manufacture of a printed-circuit board connector |
DE3430849A1 (en) * | 1984-08-22 | 1986-03-06 | Gerd 7742 St Georgen Kammerer | Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier |
-
1967
- 1967-04-28 FR FR104639A patent/FR1528075A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445736A (en) * | 1982-03-31 | 1984-05-01 | Amp Incorporated | Method and apparatus for producing a premolded packaging |
US4547964A (en) * | 1982-08-09 | 1985-10-22 | Sony Corporation | Method for the manufacture of a printed-circuit board connector |
DE3430849A1 (en) * | 1984-08-22 | 1986-03-06 | Gerd 7742 St Georgen Kammerer | Method for the three-dimensional expansion of the electrical connection between the connecting contacts of large-scale integrated electronic components and the contact points of an electrical connecting device on a component carrier |
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