FR1524373A - Ensemble à plusieurs plaquettes de circuit intégré - Google Patents

Ensemble à plusieurs plaquettes de circuit intégré

Info

Publication number
FR1524373A
FR1524373A FR101041A FR101041A FR1524373A FR 1524373 A FR1524373 A FR 1524373A FR 101041 A FR101041 A FR 101041A FR 101041 A FR101041 A FR 101041A FR 1524373 A FR1524373 A FR 1524373A
Authority
FR
France
Prior art keywords
circuit board
integrated circuit
board assembly
multiple integrated
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR101041A
Other languages
English (en)
Inventor
John Marley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US539003A external-priority patent/US3390308A/en
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Priority to FR101041A priority Critical patent/FR1524373A/fr
Application granted granted Critical
Publication of FR1524373A publication Critical patent/FR1524373A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5384—Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
FR101041A 1966-03-31 1967-03-31 Ensemble à plusieurs plaquettes de circuit intégré Expired FR1524373A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR101041A FR1524373A (fr) 1966-03-31 1967-03-31 Ensemble à plusieurs plaquettes de circuit intégré

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US539003A US3390308A (en) 1966-03-31 1966-03-31 Multiple chip integrated circuit assembly
FR101041A FR1524373A (fr) 1966-03-31 1967-03-31 Ensemble à plusieurs plaquettes de circuit intégré

Publications (1)

Publication Number Publication Date
FR1524373A true FR1524373A (fr) 1968-05-10

Family

ID=26175216

Family Applications (1)

Application Number Title Priority Date Filing Date
FR101041A Expired FR1524373A (fr) 1966-03-31 1967-03-31 Ensemble à plusieurs plaquettes de circuit intégré

Country Status (1)

Country Link
FR (1) FR1524373A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996022671A1 (fr) * 1995-01-20 1996-07-25 Minnesota Mining And Manufacturing Company Structure de circuit electronique

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996022671A1 (fr) * 1995-01-20 1996-07-25 Minnesota Mining And Manufacturing Company Structure de circuit electronique
US5631807A (en) * 1995-01-20 1997-05-20 Minnesota Mining And Manufacturing Company Electronic circuit structure with aperture suspended component
US5689600A (en) * 1995-01-20 1997-11-18 Minnesota Mining And Manufacturing Company Electronic circuit structure

Similar Documents

Publication Publication Date Title
FR1521039A (fr) Assemblage de circuits
FR96241E (fr) Assemblage de circuits.
FR1511986A (fr) Circuits intégrés à semi-conducteurs
CH456689A (de) Logischer Schaltkreis
FR1512995A (fr) Circuit à plusieurs couches
CH471472A (de) Integrierte Schaltung
DK144745C (da) Elektrisk kondensator
FR1488779A (fr) Circuit de conférence
FR1510702A (fr) Circuit à atténuation variable
FR1547183A (fr) Ensemble de circuit intégré
AT324432B (de) Integrierte schaltung
CH495634A (de) Integrierte Schaltung
FR93361E (fr) Circuit multiplicateur scalaire.
FR1524373A (fr) Ensemble à plusieurs plaquettes de circuit intégré
CH480720A (de) HF-Schaltungsanordnung
FR1522982A (fr) Circuit commutateur à semiconducteurs
YU28343B (cs) Elektronski bezbedni tajmer
FR1536887A (fr) Circuit anti-local
CH431628A (de) Anpassschaltung
FR1531709A (fr) Pâte à tartiner
FR1471226A (fr) éplucheuse à légumes
FR1508151A (fr) étui à monnaie
FR1513753A (fr) Circuit de télévision
FR1530105A (fr) Assemblage de circuit imprimé
FR1470668A (fr) Oscillateur à circuit intégré