FR1502866A - Dépôt par évaporation de couches minces de manganèse-argent - Google Patents
Dépôt par évaporation de couches minces de manganèse-argentInfo
- Publication number
- FR1502866A FR1502866A FR78303A FR78303A FR1502866A FR 1502866 A FR1502866 A FR 1502866A FR 78303 A FR78303 A FR 78303A FR 78303 A FR78303 A FR 78303A FR 1502866 A FR1502866 A FR 1502866A
- Authority
- FR
- France
- Prior art keywords
- manganese
- evaporation
- silver
- deposition
- thin layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008021 deposition Effects 0.000 title 1
- 230000008020 evaporation Effects 0.000 title 1
- 238000001704 evaporation Methods 0.000 title 1
- GZUCQIMKDHLSEH-UHFFFAOYSA-N manganese silver Chemical compound [Mn][Ag][Ag] GZUCQIMKDHLSEH-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/4966—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Contacts (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US49208865A | 1965-10-01 | 1965-10-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1502866A true FR1502866A (fr) | 1967-11-24 |
Family
ID=23954891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR78303A Expired FR1502866A (fr) | 1965-10-01 | 1966-09-30 | Dépôt par évaporation de couches minces de manganèse-argent |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE1589064A1 (fr) |
FR (1) | FR1502866A (fr) |
GB (1) | GB1115965A (fr) |
-
1966
- 1966-09-03 DE DE19661589064 patent/DE1589064A1/de active Pending
- 1966-09-22 GB GB4232466A patent/GB1115965A/en not_active Expired
- 1966-09-30 FR FR78303A patent/FR1502866A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1115965A (en) | 1968-06-06 |
DE1589064A1 (de) | 1970-03-19 |
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