FR1500624A - Procédé d'introduction du manganèse dans des corps semi-conducteurs servant à la fabrication des éléments électroniques à semi-conducteurs - Google Patents

Procédé d'introduction du manganèse dans des corps semi-conducteurs servant à la fabrication des éléments électroniques à semi-conducteurs

Info

Publication number
FR1500624A
FR1500624A FR83352A FR83352A FR1500624A FR 1500624 A FR1500624 A FR 1500624A FR 83352 A FR83352 A FR 83352A FR 83352 A FR83352 A FR 83352A FR 1500624 A FR1500624 A FR 1500624A
Authority
FR
France
Prior art keywords
manufacture
bodies used
semiconductor
semiconductor elements
introducing manganese
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR83352A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of FR1500624A publication Critical patent/FR1500624A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/06Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/74Thyristor-type devices, e.g. having four-zone regenerative action
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/062Gold diffusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S252/00Compositions
    • Y10S252/95Doping agent source material
    • Y10S252/951Doping agent source material for vapor transport
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/914Doping
    • Y10S438/917Deep level dopants, e.g. gold, chromium, iron or nickel

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Luminescent Compositions (AREA)
  • Thyristors (AREA)
FR83352A 1965-11-11 1966-11-10 Procédé d'introduction du manganèse dans des corps semi-conducteurs servant à la fabrication des éléments électroniques à semi-conducteurs Expired FR1500624A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0100447 1965-11-11

Publications (1)

Publication Number Publication Date
FR1500624A true FR1500624A (fr) 1967-11-03

Family

ID=7523066

Family Applications (1)

Application Number Title Priority Date Filing Date
FR83352A Expired FR1500624A (fr) 1965-11-11 1966-11-10 Procédé d'introduction du manganèse dans des corps semi-conducteurs servant à la fabrication des éléments électroniques à semi-conducteurs

Country Status (8)

Country Link
US (1) US3448051A (fr)
BE (1) BE689375A (fr)
CH (1) CH476517A (fr)
DE (1) DE1544271A1 (fr)
FR (1) FR1500624A (fr)
GB (1) GB1107008A (fr)
NL (1) NL6614570A (fr)
SE (1) SE301305B (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3625781A (en) * 1969-05-09 1971-12-07 Ibm Method of reducing carrier lifetime in semiconductor structures

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3108914A (en) * 1959-06-30 1963-10-29 Fairchild Camera Instr Co Transistor manufacturing process
US3109760A (en) * 1960-02-15 1963-11-05 Cievite Corp P-nu junction and method

Also Published As

Publication number Publication date
SE301305B (fr) 1968-06-04
US3448051A (en) 1969-06-03
GB1107008A (en) 1968-03-20
DE1544271A1 (de) 1969-02-27
NL6614570A (fr) 1967-05-12
BE689375A (fr) 1967-05-08
CH476517A (de) 1969-08-15

Similar Documents

Publication Publication Date Title
IT947714B (it) Procedimento e impianto per la fab bricazione di elementi costruttivi in calcestruzzo poroso
FR1313216A (fr) Perfectionnements à la fabrication d'éléments en béton
FR1382273A (fr) Procédé et appareillages pour la fabrication d'éléments de construction en béton pré-contraint
FR1500624A (fr) Procédé d'introduction du manganèse dans des corps semi-conducteurs servant à la fabrication des éléments électroniques à semi-conducteurs
FR1501354A (fr) Procédé et appareil de fabrication d'éléments en béton
FR1426555A (fr) électrode composite et procédé de fabrication d'une telle électrode
FR1464482A (fr) Structures d'interconnexion pour éléments de circuit à l'état solide et procédé de fabrication
FR1448383A (fr) Procédé de fabrication d'éléments semi-conducteurs
FR1243550A (fr) Perfectionnements à la fabrication d'articles industriels en céramique
FR1469892A (fr) Perfectionnements à la fabrication d'éléments gonflables
FR1439182A (fr) Procédé assurant la protection temporaire d'éléments métalliques
FR1455084A (fr) Perfectionnement apporté à la fabrication d'éléments filtrants
FR1452292A (fr) Perfectionnements dans la fabrication d'unités structurales
FR1541596A (fr) Procédé de délimitation de petites surfaces dans la fabrication d'éléments microélectroniques
CH543653A (fr) Procédé de fabrication d'éléments de béton avec noyau
FR1539249A (fr) Perfectionnements à la fabrication des ciments et bétons
FR82523E (fr) Perfectionnements à la fabrication d'éléments en béton
FR1397835A (fr) Procédé de fabrication d'éléments complémentaires pour fermetures à glissière
FR1366829A (fr) Procédé de fabrication d'éléments de construction
FR1413980A (fr) Procédé de fabrication d'éléments à circuit incorporé isolés
FR1325971A (fr) Machine et équipement pour la fabrication d'éléments en béton précontraint
FR1508622A (fr) Procédé de fabrication d'éléments de construction
FR90502E (fr) Procédé de fabrication d'éléments de construction
FR90511E (fr) Procédé et appareillages pour la fabrication d'éléments de construction en béton pré-contraint
FR1358289A (fr) Procédé de fabrication d'éléments de construction