FR1495162A - Metal strip for the assembly of semiconductors and semiconductors formed with this strip - Google Patents
Metal strip for the assembly of semiconductors and semiconductors formed with this stripInfo
- Publication number
- FR1495162A FR1495162A FR77612A FR77612A FR1495162A FR 1495162 A FR1495162 A FR 1495162A FR 77612 A FR77612 A FR 77612A FR 77612 A FR77612 A FR 77612A FR 1495162 A FR1495162 A FR 1495162A
- Authority
- FR
- France
- Prior art keywords
- semiconductors
- strip
- assembly
- metal strip
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR77612A FR1495162A (en) | 1965-10-22 | 1966-09-26 | Metal strip for the assembly of semiconductors and semiconductors formed with this strip |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US50155065A | 1965-10-22 | 1965-10-22 | |
US504402A US3391426A (en) | 1965-10-22 | 1965-10-24 | Molding apparatus |
FR77612A FR1495162A (en) | 1965-10-22 | 1966-09-26 | Metal strip for the assembly of semiconductors and semiconductors formed with this strip |
US69239667A | 1967-12-21 | 1967-12-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1495162A true FR1495162A (en) | 1967-09-15 |
Family
ID=27444711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR77612A Expired FR1495162A (en) | 1965-10-22 | 1966-09-26 | Metal strip for the assembly of semiconductors and semiconductors formed with this strip |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1495162A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1951583A1 (en) * | 1968-10-15 | 1971-02-04 | Rca Corp | Semiconductor devices with an elongated body made of malleable material |
-
1966
- 1966-09-26 FR FR77612A patent/FR1495162A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1951583A1 (en) * | 1968-10-15 | 1971-02-04 | Rca Corp | Semiconductor devices with an elongated body made of malleable material |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SE386605B (en) | KIT FOR CONTINUOUS EXTENSION OF METAL AND DEVICE FOR PERFORMING THE KIT | |
Johnson | Aeneas and the Ironies of Pietas | |
BE608907A (en) | Improvements in the assembly of metal sheets. | |
AT268570B (en) | Device for the continuous casting of metal | |
FR1431072A (en) | Improvement in the adhesion of rubbers | |
FR1501221A (en) | Reducing the amplitude of an oscillogram | |
FR1495162A (en) | Metal strip for the assembly of semiconductors and semiconductors formed with this strip | |
FR1454192A (en) | Assembly for the integration of quick-run operations that occur once | |
FR1280317A (en) | Fittings for the assembly of tubular elements | |
FR1460453A (en) | Corner assembly device for metal frames and similar constructions | |
FR1380715A (en) | Improvements in the assembly of construction elements on assembly elements and elements for this assembly | |
FR1378609A (en) | Swing assembly and suspension part | |
FR1377561A (en) | Device for the watertight and easily removable assembly of the constituent elements of a metal body and other applications | |
FR1334784A (en) | metal elements that can be combined for the erection of a frame | |
FR1359020A (en) | Metal profile for frame combined with other elements | |
FR1464492A (en) | Chassis for the assembly of several semiconductor rectifier elements | |
FR1358328A (en) | Bracelet with clasp for timepiece | |
FR1432470A (en) | Piece of clothing | |
FR1385147A (en) | Device for the assembly of frame and similar elements and special bracket applied for this purpose | |
CH520786A (en) | Corrosion-resistant metal and use of the same | |
FR1451905A (en) | Improvements in the production of metal ingots | |
FR1447279A (en) | Copolymers of olefins with polythioethers diene | |
FR1467617A (en) | Improvement in the layout of garages | |
FR1481650A (en) | Alloys based on colombium and hafnium with the addition of yttrium | |
Perella | Leopardi and the Theory of Poetry |