FR1493471A - Method of assembling electronic devices comprising a plurality of parallel plates - Google Patents

Method of assembling electronic devices comprising a plurality of parallel plates

Info

Publication number
FR1493471A
FR1493471A FR60391A FR60391A FR1493471A FR 1493471 A FR1493471 A FR 1493471A FR 60391 A FR60391 A FR 60391A FR 60391 A FR60391 A FR 60391A FR 1493471 A FR1493471 A FR 1493471A
Authority
FR
France
Prior art keywords
electronic devices
parallel plates
assembling electronic
assembling
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR60391A
Other languages
French (fr)
Inventor
Henri Thouvenin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RADIOTECHNIQUE COPRIM RTC
Original Assignee
RADIOTECHNIQUE COPRIM RTC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RADIOTECHNIQUE COPRIM RTC filed Critical RADIOTECHNIQUE COPRIM RTC
Priority to FR60391A priority Critical patent/FR1493471A/en
Application granted granted Critical
Publication of FR1493471A publication Critical patent/FR1493471A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/144Stacked arrangements of planar printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385Assembly of a plurality of insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10287Metal wires as connectors or conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/10886Other details
    • H05K2201/10946Leads attached onto leadless component after manufacturing the component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
FR60391A 1966-05-05 1966-05-05 Method of assembling electronic devices comprising a plurality of parallel plates Expired FR1493471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR60391A FR1493471A (en) 1966-05-05 1966-05-05 Method of assembling electronic devices comprising a plurality of parallel plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR60391A FR1493471A (en) 1966-05-05 1966-05-05 Method of assembling electronic devices comprising a plurality of parallel plates

Publications (1)

Publication Number Publication Date
FR1493471A true FR1493471A (en) 1967-09-01

Family

ID=8607902

Family Applications (1)

Application Number Title Priority Date Filing Date
FR60391A Expired FR1493471A (en) 1966-05-05 1966-05-05 Method of assembling electronic devices comprising a plurality of parallel plates

Country Status (1)

Country Link
FR (1) FR1493471A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492537A (en) * 1967-12-11 1970-01-27 Zenith Radio Corp Modular interconnection system
US4587594A (en) * 1982-06-19 1986-05-06 Ferranti, Plc Electrical circuit assemblies

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3492537A (en) * 1967-12-11 1970-01-27 Zenith Radio Corp Modular interconnection system
US4587594A (en) * 1982-06-19 1986-05-06 Ferranti, Plc Electrical circuit assemblies

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