FR1487033A - Unit block of circuits and method for forming it - Google Patents

Unit block of circuits and method for forming it

Info

Publication number
FR1487033A
FR1487033A FR69956A FR69956A FR1487033A FR 1487033 A FR1487033 A FR 1487033A FR 69956 A FR69956 A FR 69956A FR 69956 A FR69956 A FR 69956A FR 1487033 A FR1487033 A FR 1487033A
Authority
FR
France
Prior art keywords
circuits
forming
unit block
block
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR69956A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Technologies Corp
Original Assignee
United Aircraft Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US473023A external-priority patent/US3370203A/en
Application filed by United Aircraft Corp filed Critical United Aircraft Corp
Priority to FR69956A priority Critical patent/FR1487033A/en
Application granted granted Critical
Publication of FR1487033A publication Critical patent/FR1487033A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/1064—Electrical connections provided on a side surface of one or more of the containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1094—Thermal management, e.g. cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
FR69956A 1965-07-19 1966-07-19 Unit block of circuits and method for forming it Expired FR1487033A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR69956A FR1487033A (en) 1965-07-19 1966-07-19 Unit block of circuits and method for forming it

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US473023A US3370203A (en) 1965-07-19 1965-07-19 Integrated circuit modules
FR69956A FR1487033A (en) 1965-07-19 1966-07-19 Unit block of circuits and method for forming it

Publications (1)

Publication Number Publication Date
FR1487033A true FR1487033A (en) 1967-06-30

Family

ID=26172060

Family Applications (1)

Application Number Title Priority Date Filing Date
FR69956A Expired FR1487033A (en) 1965-07-19 1966-07-19 Unit block of circuits and method for forming it

Country Status (1)

Country Link
FR (1) FR1487033A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0476136A1 (en) * 1990-01-24 1992-03-25 Sovmestnoe Sovetsko-Zapadno-Berlinskoe Predpriyatie "Info-Glabal" Three-dimensional electronic unit and method of construction
US6219240B1 (en) 1998-07-02 2001-04-17 R-Amtech International, Inc. Three-dimensional electronic module and a method of its fabrication and repair
EP3059763A1 (en) * 2015-02-20 2016-08-24 3D Plus Method for manufacturing a 3d electronic module with external interconnection leads

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0476136A1 (en) * 1990-01-24 1992-03-25 Sovmestnoe Sovetsko-Zapadno-Berlinskoe Predpriyatie "Info-Glabal" Three-dimensional electronic unit and method of construction
EP0476136A4 (en) * 1990-01-24 1992-04-22 Nauchno-Proizvodstvenny Tsentr Elektronnoi Mikrotekhnologii Akademii Nauk Ssr Three-dimensional electronic unit and method of construction
US6219240B1 (en) 1998-07-02 2001-04-17 R-Amtech International, Inc. Three-dimensional electronic module and a method of its fabrication and repair
EP3059763A1 (en) * 2015-02-20 2016-08-24 3D Plus Method for manufacturing a 3d electronic module with external interconnection leads
FR3033082A1 (en) * 2015-02-20 2016-08-26 3D Plus METHOD OF MANUFACTURING A 3D ELECTRONIC MODULE WITH EXTERNAL INTERCONNECT PINS
CN105914153A (en) * 2015-02-20 2016-08-31 3D加公司 Method for manufacturing a 3d electronic module with external interconnection leads
US9659846B2 (en) 2015-02-20 2017-05-23 3D Plus Process for manufacturing a 3D electronic module comprising external interconnection leads
CN105914153B (en) * 2015-02-20 2020-03-20 3D加公司 Process for manufacturing a 3D electronic module comprising external interconnect pins

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