FR1475368A - Method of manufacturing hermetically molded semiconductor devices and novel products thus obtained - Google Patents
Method of manufacturing hermetically molded semiconductor devices and novel products thus obtainedInfo
- Publication number
- FR1475368A FR1475368A FR57104A FR57104A FR1475368A FR 1475368 A FR1475368 A FR 1475368A FR 57104 A FR57104 A FR 57104A FR 57104 A FR57104 A FR 57104A FR 1475368 A FR1475368 A FR 1475368A
- Authority
- FR
- France
- Prior art keywords
- semiconductor devices
- molded semiconductor
- novel products
- manufacturing hermetically
- hermetically molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR57104A FR1475368A (en) | 1965-04-10 | 1966-04-08 | Method of manufacturing hermetically molded semiconductor devices and novel products thus obtained |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2107765 | 1965-04-10 | ||
FR57104A FR1475368A (en) | 1965-04-10 | 1966-04-08 | Method of manufacturing hermetically molded semiconductor devices and novel products thus obtained |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1475368A true FR1475368A (en) | 1967-03-31 |
Family
ID=26169863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR57104A Expired FR1475368A (en) | 1965-04-10 | 1966-04-08 | Method of manufacturing hermetically molded semiconductor devices and novel products thus obtained |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1475368A (en) |
-
1966
- 1966-04-08 FR FR57104A patent/FR1475368A/en not_active Expired
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