FR1473197A - Method of forming electrical connections, and resulting parts - Google Patents

Method of forming electrical connections, and resulting parts

Info

Publication number
FR1473197A
FR1473197A FR47058A FR47058A FR1473197A FR 1473197 A FR1473197 A FR 1473197A FR 47058 A FR47058 A FR 47058A FR 47058 A FR47058 A FR 47058A FR 1473197 A FR1473197 A FR 1473197A
Authority
FR
France
Prior art keywords
electrical connections
forming electrical
resulting parts
resulting
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR47058A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US428447A external-priority patent/US3323198A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to FR47058A priority Critical patent/FR1473197A/en
Application granted granted Critical
Publication of FR1473197A publication Critical patent/FR1473197A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
FR47058A 1965-01-27 1966-01-25 Method of forming electrical connections, and resulting parts Expired FR1473197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR47058A FR1473197A (en) 1965-01-27 1966-01-25 Method of forming electrical connections, and resulting parts

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US428447A US3323198A (en) 1965-01-27 1965-01-27 Electrical interconnections
US43642165A 1965-02-26 1965-02-26
FR47058A FR1473197A (en) 1965-01-27 1966-01-25 Method of forming electrical connections, and resulting parts

Publications (1)

Publication Number Publication Date
FR1473197A true FR1473197A (en) 1967-03-17

Family

ID=27242834

Family Applications (1)

Application Number Title Priority Date Filing Date
FR47058A Expired FR1473197A (en) 1965-01-27 1966-01-25 Method of forming electrical connections, and resulting parts

Country Status (1)

Country Link
FR (1) FR1473197A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0127020A2 (en) * 1983-05-31 1984-12-05 Kabushiki Kaisha Toshiba Method of manufacturing multi-layer semiconductor device
EP0196374A1 (en) * 1979-08-10 1986-10-08 Massachusetts Institute Of Technology Semiconductor embedded layer technology
US8322780B2 (en) 2010-12-20 2012-12-04 Sabic Innovative Plastics Ip B.V. Reinforced body in white and method of making and using the same
US8336933B2 (en) 2010-11-04 2012-12-25 Sabic Innovative Plastics Ip B.V. Energy absorbing device and methods of making and using the same
US8864216B2 (en) 2013-01-18 2014-10-21 Sabic Global Technologies B.V. Reinforced body in white and method of making and using the same
US9067550B2 (en) 2013-01-18 2015-06-30 Sabic Global Technologies B.V. Polymer, energy absorber rail extension, methods of making and vehicles using the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0196374A1 (en) * 1979-08-10 1986-10-08 Massachusetts Institute Of Technology Semiconductor embedded layer technology
EP0127020A2 (en) * 1983-05-31 1984-12-05 Kabushiki Kaisha Toshiba Method of manufacturing multi-layer semiconductor device
EP0127020A3 (en) * 1983-05-31 1987-08-26 Kabushiki Kaisha Toshiba Method of manufacturing multi-layer semiconductor device
US8336933B2 (en) 2010-11-04 2012-12-25 Sabic Innovative Plastics Ip B.V. Energy absorbing device and methods of making and using the same
US8474583B2 (en) 2010-11-04 2013-07-02 Sabic Innovative Plastics Ip B.V. Impact device and methods of making and using the same
US8322780B2 (en) 2010-12-20 2012-12-04 Sabic Innovative Plastics Ip B.V. Reinforced body in white and method of making and using the same
US8864216B2 (en) 2013-01-18 2014-10-21 Sabic Global Technologies B.V. Reinforced body in white and method of making and using the same
US9067550B2 (en) 2013-01-18 2015-06-30 Sabic Global Technologies B.V. Polymer, energy absorber rail extension, methods of making and vehicles using the same
US9469264B2 (en) 2013-01-18 2016-10-18 Sabic Global Technologies B.V. Polymer, energy absorber rail extension, methods of making and vehicles using the same

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