FR1468582A - Procédé d'enveloppement d'un composant électrique - Google Patents

Procédé d'enveloppement d'un composant électrique

Info

Publication number
FR1468582A
FR1468582A FR50222A FR50222A FR1468582A FR 1468582 A FR1468582 A FR 1468582A FR 50222 A FR50222 A FR 50222A FR 50222 A FR50222 A FR 50222A FR 1468582 A FR1468582 A FR 1468582A
Authority
FR
France
Prior art keywords
enveloping
electrical component
electrical
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR50222A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Priority to FR50222A priority Critical patent/FR1468582A/fr
Application granted granted Critical
Publication of FR1468582A publication Critical patent/FR1468582A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
FR50222A 1965-02-19 1966-02-18 Procédé d'enveloppement d'un composant électrique Expired FR1468582A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR50222A FR1468582A (fr) 1965-02-19 1966-02-18 Procédé d'enveloppement d'un composant électrique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP0036106 1965-02-19
FR50222A FR1468582A (fr) 1965-02-19 1966-02-18 Procédé d'enveloppement d'un composant électrique

Publications (1)

Publication Number Publication Date
FR1468582A true FR1468582A (fr) 1967-02-03

Family

ID=25990372

Family Applications (1)

Application Number Title Priority Date Filing Date
FR50222A Expired FR1468582A (fr) 1965-02-19 1966-02-18 Procédé d'enveloppement d'un composant électrique

Country Status (1)

Country Link
FR (1) FR1468582A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2102512A5 (fr) * 1970-08-06 1972-04-07 Liaison Electr Silec

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2102512A5 (fr) * 1970-08-06 1972-04-07 Liaison Electr Silec

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