FR1465435A - Manufacturing process of thin-film electronic components and integrated circuits by vaporization by means of laser and corresponding apparatus - Google Patents
Manufacturing process of thin-film electronic components and integrated circuits by vaporization by means of laser and corresponding apparatusInfo
- Publication number
- FR1465435A FR1465435A FR29685A FR29685A FR1465435A FR 1465435 A FR1465435 A FR 1465435A FR 29685 A FR29685 A FR 29685A FR 29685 A FR29685 A FR 29685A FR 1465435 A FR1465435 A FR 1465435A
- Authority
- FR
- France
- Prior art keywords
- vaporization
- laser
- thin
- manufacturing process
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR29685A FR1465435A (en) | 1965-08-27 | 1965-08-27 | Manufacturing process of thin-film electronic components and integrated circuits by vaporization by means of laser and corresponding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR29685A FR1465435A (en) | 1965-08-27 | 1965-08-27 | Manufacturing process of thin-film electronic components and integrated circuits by vaporization by means of laser and corresponding apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1465435A true FR1465435A (en) | 1967-01-13 |
Family
ID=8587373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR29685A Expired FR1465435A (en) | 1965-08-27 | 1965-08-27 | Manufacturing process of thin-film electronic components and integrated circuits by vaporization by means of laser and corresponding apparatus |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1465435A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT381122B (en) * | 1974-11-29 | 1986-08-25 | Lohja Ab Oy | METHOD FOR GROWING CONNECTIVE THIN LAYERS |
EP2644308A1 (en) * | 2012-03-31 | 2013-10-02 | Fei Company | System for protecting light optical components during laser ablation |
US9216475B2 (en) | 2012-03-31 | 2015-12-22 | Fei Company | System for protecting light optical components during laser ablation |
EP2852968A4 (en) * | 2012-05-22 | 2016-02-24 | Arctic Ip Invest Ab | Coating and material method |
-
1965
- 1965-08-27 FR FR29685A patent/FR1465435A/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT381122B (en) * | 1974-11-29 | 1986-08-25 | Lohja Ab Oy | METHOD FOR GROWING CONNECTIVE THIN LAYERS |
EP2644308A1 (en) * | 2012-03-31 | 2013-10-02 | Fei Company | System for protecting light optical components during laser ablation |
CN103358035A (en) * | 2012-03-31 | 2013-10-23 | Fei公司 | System for protecting light optical components during laser ablation |
US9216475B2 (en) | 2012-03-31 | 2015-12-22 | Fei Company | System for protecting light optical components during laser ablation |
CN103358035B (en) * | 2012-03-31 | 2017-07-18 | Fei公司 | System for protecting ray optics component during laser ablation |
EP2852968A4 (en) * | 2012-05-22 | 2016-02-24 | Arctic Ip Invest Ab | Coating and material method |
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