FR1438991A - Improvements concerning the constitution of electrically conductive and thermally conductive connections - Google Patents
Improvements concerning the constitution of electrically conductive and thermally conductive connectionsInfo
- Publication number
- FR1438991A FR1438991A FR24191A FR24191A FR1438991A FR 1438991 A FR1438991 A FR 1438991A FR 24191 A FR24191 A FR 24191A FR 24191 A FR24191 A FR 24191A FR 1438991 A FR1438991 A FR 1438991A
- Authority
- FR
- France
- Prior art keywords
- constitution
- electrically conductive
- thermally conductive
- improvements concerning
- connections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/68—Connections to or between superconductive connectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0184—Manufacture or treatment of devices comprising intermetallic compounds of type A-15, e.g. Nb3Sn
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR24191A FR1438991A (en) | 1964-07-17 | 1965-07-09 | Improvements concerning the constitution of electrically conductive and thermally conductive connections |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US383392A US3372470A (en) | 1964-07-17 | 1964-07-17 | Process for making composite conductors |
FR24191A FR1438991A (en) | 1964-07-17 | 1965-07-09 | Improvements concerning the constitution of electrically conductive and thermally conductive connections |
US66453767A | 1967-08-30 | 1967-08-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1438991A true FR1438991A (en) | 1966-05-13 |
Family
ID=27242320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR24191A Expired FR1438991A (en) | 1964-07-17 | 1965-07-09 | Improvements concerning the constitution of electrically conductive and thermally conductive connections |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1438991A (en) |
-
1965
- 1965-07-09 FR FR24191A patent/FR1438991A/en not_active Expired
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