FR1430438A - Dispositifs semi-conducteurs renfermant un écran conducteur - Google Patents

Dispositifs semi-conducteurs renfermant un écran conducteur

Info

Publication number
FR1430438A
FR1430438A FR5354A FR5354A FR1430438A FR 1430438 A FR1430438 A FR 1430438A FR 5354 A FR5354 A FR 5354A FR 5354 A FR5354 A FR 5354A FR 1430438 A FR1430438 A FR 1430438A
Authority
FR
France
Prior art keywords
semiconductor devices
devices incorporating
conductive screen
conductive
screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR5354A
Other languages
English (en)
Inventor
Alberto Loro
Stanley Daniel Rosenbaum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nortel Networks Ltd
Original Assignee
Northern Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CA900,547A external-priority patent/CA941074A/en
Application filed by Northern Electric Co Ltd filed Critical Northern Electric Co Ltd
Priority to FR5354A priority Critical patent/FR1430438A/fr
Application granted granted Critical
Publication of FR1430438A publication Critical patent/FR1430438A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
FR5354A 1964-04-16 1965-02-12 Dispositifs semi-conducteurs renfermant un écran conducteur Expired FR1430438A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR5354A FR1430438A (fr) 1964-04-16 1965-02-12 Dispositifs semi-conducteurs renfermant un écran conducteur

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CA900,547A CA941074A (en) 1964-04-16 1964-04-16 Semiconductor devices with field electrodes
CA904967 1964-06-12
FR5354A FR1430438A (fr) 1964-04-16 1965-02-12 Dispositifs semi-conducteurs renfermant un écran conducteur

Publications (1)

Publication Number Publication Date
FR1430438A true FR1430438A (fr) 1966-03-04

Family

ID=27168599

Family Applications (1)

Application Number Title Priority Date Filing Date
FR5354A Expired FR1430438A (fr) 1964-04-16 1965-02-12 Dispositifs semi-conducteurs renfermant un écran conducteur

Country Status (1)

Country Link
FR (1) FR1430438A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2028452A1 (fr) * 1969-01-16 1970-10-09 Signetics Corp
FR2454702A1 (fr) * 1979-04-19 1980-11-14 Philips Nv Dispositif semi-conducteur notamment diode, transistor, thyristor comportant des moyens ameliores de passivation
FR2505091A1 (fr) * 1981-04-30 1982-11-05 Cii Honeywell Bull Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques
EP0071031A2 (fr) * 1981-07-31 1983-02-09 GAO Gesellschaft für Automation und Organisation mbH Elément porteur pour un composant à circuit intégré

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2028452A1 (fr) * 1969-01-16 1970-10-09 Signetics Corp
FR2454702A1 (fr) * 1979-04-19 1980-11-14 Philips Nv Dispositif semi-conducteur notamment diode, transistor, thyristor comportant des moyens ameliores de passivation
FR2505091A1 (fr) * 1981-04-30 1982-11-05 Cii Honeywell Bull Dispositif de protection des circuits electroniques tels que des circuits integres a l'encontre des charges electrostatiques
EP0065437A1 (fr) * 1981-04-30 1982-11-24 COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) Dispositif de protection des circuits électroniques tels que des circuits intégrés à l'encontre des charges électrostatiques
EP0071031A2 (fr) * 1981-07-31 1983-02-09 GAO Gesellschaft für Automation und Organisation mbH Elément porteur pour un composant à circuit intégré
EP0071031A3 (fr) * 1981-07-31 1984-09-05 GAO Gesellschaft für Automation und Organisation mbH Elément porteur pour un composant à circuit intégré
US4617605A (en) * 1981-07-31 1986-10-14 Gao Gesellschaft Fur Automation Und Organisation Carrier element for an IC module

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