FR1417088A - Pastilles composites isolantes et semi-conductrices - Google Patents
Pastilles composites isolantes et semi-conductricesInfo
- Publication number
- FR1417088A FR1417088A FR998455A FR998455A FR1417088A FR 1417088 A FR1417088 A FR 1417088A FR 998455 A FR998455 A FR 998455A FR 998455 A FR998455 A FR 998455A FR 1417088 A FR1417088 A FR 1417088A
- Authority
- FR
- France
- Prior art keywords
- insulating
- composite pellets
- semiconducting composite
- semiconducting
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR998455A FR1417088A (fr) | 1963-12-16 | 1964-12-14 | Pastilles composites isolantes et semi-conductrices |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US330690A US3290760A (en) | 1963-12-16 | 1963-12-16 | Method of making a composite insulator semiconductor wafer |
US354240A US3354354A (en) | 1964-03-24 | 1964-03-24 | Oxide bonded semiconductor wafer utilizing intrinsic and degenerate material |
FR998455A FR1417088A (fr) | 1963-12-16 | 1964-12-14 | Pastilles composites isolantes et semi-conductrices |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1417088A true FR1417088A (fr) | 1965-11-05 |
Family
ID=27248558
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR998455A Expired FR1417088A (fr) | 1963-12-16 | 1964-12-14 | Pastilles composites isolantes et semi-conductrices |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1417088A (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0076101A2 (fr) * | 1981-09-25 | 1983-04-06 | Kabushiki Kaisha Toshiba | Procédé de fabrication d'un dispositif semi-conducteur empilé |
-
1964
- 1964-12-14 FR FR998455A patent/FR1417088A/fr not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0076101A2 (fr) * | 1981-09-25 | 1983-04-06 | Kabushiki Kaisha Toshiba | Procédé de fabrication d'un dispositif semi-conducteur empilé |
EP0076101A3 (en) * | 1981-09-25 | 1984-09-05 | Kabushiki Kaisha Toshiba | Stacked semiconductor device |
US4569700A (en) * | 1981-09-25 | 1986-02-11 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of manufacturing a stacked semiconductor device |
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