FR1398423A - Bombardment cutting device - Google Patents

Bombardment cutting device

Info

Publication number
FR1398423A
FR1398423A FR977865A FR977865A FR1398423A FR 1398423 A FR1398423 A FR 1398423A FR 977865 A FR977865 A FR 977865A FR 977865 A FR977865 A FR 977865A FR 1398423 A FR1398423 A FR 1398423A
Authority
FR
France
Prior art keywords
bombardment
cutting device
cutting
bombardment cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR977865A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1398423A publication Critical patent/FR1398423A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0675—Grinders for cutting-off methods therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR977865A 1963-06-27 1964-06-11 Bombardment cutting device Expired FR1398423A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US291133A US3241265A (en) 1963-06-27 1963-06-27 Bombardment cutter

Publications (1)

Publication Number Publication Date
FR1398423A true FR1398423A (en) 1965-05-07

Family

ID=23118999

Family Applications (1)

Application Number Title Priority Date Filing Date
FR977865A Expired FR1398423A (en) 1963-06-27 1964-06-11 Bombardment cutting device

Country Status (5)

Country Link
US (1) US3241265A (en)
DE (1) DE1228986B (en)
FR (1) FR1398423A (en)
GB (1) GB996696A (en)
NL (1) NL6406536A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2408218A1 (en) * 1977-11-03 1979-06-01 Gen Electric PROCESS FOR DIVIDING A SLICE OF SEMICONDUCTOR INTO PELLETS

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3915770A (en) * 1974-12-16 1975-10-28 Ibm Method and apparatus for thermo-chemically slicing crystal boules
AT376389B (en) * 1981-07-20 1984-11-12 Swarovski Tyrolit Schleif ABRASIVE TOOLS TO SUPPORT GRINDING OR SEPARATING A WORKPIECE
EP0082227A1 (en) * 1981-12-17 1983-06-29 Jacques Paul Jean Tostain System for adjusting the wear of a grinding wheel on automatic cutting-off machines
AT382809B (en) * 1984-08-13 1987-04-10 Voest Alpine Ag CUTTING MACHINE FOR ROLLING GOODS WITH A ROTATING CUTTING TOOL, ESPECIALLY A GRINDING WHEEL
JP3102364B2 (en) * 1996-11-06 2000-10-23 株式会社村田製作所 Slicing method and slicing device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US217709A (en) * 1879-07-22 Improvement in the art of engraving and dressing glass and other substances
GB432504A (en) * 1934-01-29 1935-07-29 Robert Corson Angell Improvements relating to the abrading of hard material
US2092962A (en) * 1935-03-04 1937-09-14 Horace B Fay Sand blasting apparatus
US2135550A (en) * 1935-07-10 1938-11-08 American Foundry Equip Co Method and apparatus for cleaning by abrasive action
US2663980A (en) * 1949-10-14 1953-12-29 John F Harper Polishing method and material
US2691858A (en) * 1951-10-24 1954-10-19 Bell Telephone Labor Inc Cutting tool
US2774194A (en) * 1954-11-08 1956-12-18 Charles J Thatcher Ultrasonic tools
US2985050A (en) * 1958-10-13 1961-05-23 North American Aviation Inc Liquid cutting of hard materials
FR1240358A (en) * 1959-04-10 1960-09-02 Intermetall Process for cutting semiconductor materials and elements conforming to those obtained

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2408218A1 (en) * 1977-11-03 1979-06-01 Gen Electric PROCESS FOR DIVIDING A SLICE OF SEMICONDUCTOR INTO PELLETS

Also Published As

Publication number Publication date
DE1228986B (en) 1966-11-17
GB996696A (en) 1965-06-30
DE1228986C2 (en) 1976-06-16
NL6406536A (en) 1964-12-28
US3241265A (en) 1966-03-22

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