FR1378158A - Procédé de fabrication de panneaux de câblage imprimé à plusieurs couches - Google Patents

Procédé de fabrication de panneaux de câblage imprimé à plusieurs couches

Info

Publication number
FR1378158A
FR1378158A FR948221A FR948221A FR1378158A FR 1378158 A FR1378158 A FR 1378158A FR 948221 A FR948221 A FR 948221A FR 948221 A FR948221 A FR 948221A FR 1378158 A FR1378158 A FR 1378158A
Authority
FR
France
Prior art keywords
manufacturing process
printed wiring
layer printed
wiring panels
panels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR948221A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North American Aviation Corp
Original Assignee
North American Aviation Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North American Aviation Corp filed Critical North American Aviation Corp
Priority to FR948221A priority Critical patent/FR1378158A/fr
Application granted granted Critical
Publication of FR1378158A publication Critical patent/FR1378158A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
FR948221A 1963-09-20 1963-09-20 Procédé de fabrication de panneaux de câblage imprimé à plusieurs couches Expired FR1378158A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR948221A FR1378158A (fr) 1963-09-20 1963-09-20 Procédé de fabrication de panneaux de câblage imprimé à plusieurs couches

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR948221A FR1378158A (fr) 1963-09-20 1963-09-20 Procédé de fabrication de panneaux de câblage imprimé à plusieurs couches

Publications (1)

Publication Number Publication Date
FR1378158A true FR1378158A (fr) 1964-11-13

Family

ID=8812814

Family Applications (1)

Application Number Title Priority Date Filing Date
FR948221A Expired FR1378158A (fr) 1963-09-20 1963-09-20 Procédé de fabrication de panneaux de câblage imprimé à plusieurs couches

Country Status (1)

Country Link
FR (1) FR1378158A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1765341B1 (de) * 1967-06-26 1972-02-03 Control Data Corp Verfahren zur herstellung einer mehrlagigen gedruckten schaltung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1765341B1 (de) * 1967-06-26 1972-02-03 Control Data Corp Verfahren zur herstellung einer mehrlagigen gedruckten schaltung

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