FR1375201A - Chemical polishing process of copper and its alloys - Google Patents

Chemical polishing process of copper and its alloys

Info

Publication number
FR1375201A
FR1375201A FR946304A FR946304A FR1375201A FR 1375201 A FR1375201 A FR 1375201A FR 946304 A FR946304 A FR 946304A FR 946304 A FR946304 A FR 946304A FR 1375201 A FR1375201 A FR 1375201A
Authority
FR
France
Prior art keywords
alloys
copper
polishing process
chemical polishing
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR946304A
Other languages
French (fr)
Inventor
Rodolphe Lacal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique SA
Original Assignee
Radiotechnique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE652530D priority Critical patent/BE652530A/xx
Application filed by Radiotechnique SA filed Critical Radiotechnique SA
Priority to FR946304A priority patent/FR1375201A/en
Priority to GB35334/64A priority patent/GB1062103A/en
Priority to US393400A priority patent/US3345225A/en
Priority to CH1134864A priority patent/CH461918A/en
Priority to DEN25440A priority patent/DE1289381B/en
Application granted granted Critical
Publication of FR1375201A publication Critical patent/FR1375201A/en
Priority to OA51141A priority patent/OA01050A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
FR946304A 1963-09-02 1963-09-02 Chemical polishing process of copper and its alloys Expired FR1375201A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
BE652530D BE652530A (en) 1963-09-02
FR946304A FR1375201A (en) 1963-09-02 1963-09-02 Chemical polishing process of copper and its alloys
GB35334/64A GB1062103A (en) 1963-09-02 1964-08-28 Improvements in or relating to methods of chemically treating copper and copper alloys
US393400A US3345225A (en) 1963-09-02 1964-08-31 Method of chemically polishing copper and copper alloys
CH1134864A CH461918A (en) 1963-09-02 1964-08-31 Process for the chemical polishing of copper-containing surfaces
DEN25440A DE1289381B (en) 1963-09-02 1964-08-31 Process for chemical polishing of copper and copper alloys
OA51141A OA01050A (en) 1963-09-02 1964-12-30 Chemical polishing process of copper and its alloys.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR946304A FR1375201A (en) 1963-09-02 1963-09-02 Chemical polishing process of copper and its alloys

Publications (1)

Publication Number Publication Date
FR1375201A true FR1375201A (en) 1964-10-16

Family

ID=8811563

Family Applications (1)

Application Number Title Priority Date Filing Date
FR946304A Expired FR1375201A (en) 1963-09-02 1963-09-02 Chemical polishing process of copper and its alloys

Country Status (7)

Country Link
US (1) US3345225A (en)
BE (1) BE652530A (en)
CH (1) CH461918A (en)
DE (1) DE1289381B (en)
FR (1) FR1375201A (en)
GB (1) GB1062103A (en)
OA (1) OA01050A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL154561B (en) * 1965-04-27 1977-09-15 Lancy Lab METHOD OF REMOVING COPPER (I) OXIDE AND COPPER (II) OXIDE FROM AN OBJECT WITH A SURFACE OF COPPER OR A COPPER ALLOY, METHOD OF PREPARING ANY APPLICABLE REQUIREMENT FOR THIS APPLICATION.
US3983075A (en) * 1974-06-21 1976-09-28 Kennecott Copper Corporation Copper filled conductive epoxy
US4754803A (en) * 1987-02-02 1988-07-05 Phelps Dodge Industries, Inc. Manufacturing copper rod by casting, hot rolling and chemically shaving and pickling
US4946520A (en) * 1987-02-02 1990-08-07 Phelps Dodge Industries, Inc. Copper rod manufactured by casting, hot rolling and chemically shaving and pickling
US4812173A (en) * 1987-05-01 1989-03-14 Ciba-Geigy Corporation Stabilized hydrogen peroxide contact lens disinfecting solution
BE1003761A3 (en) * 1989-10-24 1992-06-09 Solvay Baths and method for polish chemical surface copper or copper alloy.
US6464893B1 (en) 2000-05-09 2002-10-15 Pace University Process for preparation of thin metallic foils and organic thin-film-metal structures

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2154451A (en) * 1934-12-17 1939-04-18 Du Pont Bright dip
US2211400A (en) * 1938-08-10 1940-08-13 Chase Brass & Copper Co Pickling solution for copper-base alloys
US2428804A (en) * 1945-09-07 1947-10-14 Esther M Terry Copper cleaning composition
NL269606A (en) * 1960-10-15

Also Published As

Publication number Publication date
OA01050A (en) 1968-08-07
US3345225A (en) 1967-10-03
BE652530A (en)
DE1289381B (en) 1969-02-13
CH461918A (en) 1968-08-31
GB1062103A (en) 1967-03-15

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