FR1372216A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- FR1372216A FR1372216A FR950519A FR950519A FR1372216A FR 1372216 A FR1372216 A FR 1372216A FR 950519 A FR950519 A FR 950519A FR 950519 A FR950519 A FR 950519A FR 1372216 A FR1372216 A FR 1372216A
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR950519A FR1372216A (en) | 1962-10-15 | 1963-10-14 | Semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE1099862A SE311196B (en) | 1962-10-15 | 1962-10-15 | |
FR950519A FR1372216A (en) | 1962-10-15 | 1963-10-14 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1372216A true FR1372216A (en) | 1964-09-11 |
Family
ID=26203866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR950519A Expired FR1372216A (en) | 1962-10-15 | 1963-10-14 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1372216A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0018890A1 (en) * | 1979-05-02 | 1980-11-12 | Thomson-Csf | Electrical insulating support with low thermal resistance, and base or box for power component, comprising such a support |
-
1963
- 1963-10-14 FR FR950519A patent/FR1372216A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0018890A1 (en) * | 1979-05-02 | 1980-11-12 | Thomson-Csf | Electrical insulating support with low thermal resistance, and base or box for power component, comprising such a support |
FR2455785A1 (en) * | 1979-05-02 | 1980-11-28 | Thomson Csf | ELECTRICAL INSULATOR SUPPORT, WITH LOW THERMAL RESISTANCE, AND BASE OR HOUSING FOR POWER COMPONENT, INCLUDING SUCH SUPPORT |
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