FR1368142A - Device for cooling electronic components - Google Patents

Device for cooling electronic components

Info

Publication number
FR1368142A
FR1368142A FR932833A FR932833A FR1368142A FR 1368142 A FR1368142 A FR 1368142A FR 932833 A FR932833 A FR 932833A FR 932833 A FR932833 A FR 932833A FR 1368142 A FR1368142 A FR 1368142A
Authority
FR
France
Prior art keywords
electronic components
cooling electronic
cooling
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR932833A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Electronic Research Corp
Original Assignee
International Electronic Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US223170A external-priority patent/US3213324A/en
Application filed by International Electronic Research Corp filed Critical International Electronic Research Corp
Priority to FR932833A priority Critical patent/FR1368142A/en
Application granted granted Critical
Publication of FR1368142A publication Critical patent/FR1368142A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR932833A 1962-09-12 1963-04-26 Device for cooling electronic components Expired FR1368142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR932833A FR1368142A (en) 1962-09-12 1963-04-26 Device for cooling electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US223170A US3213324A (en) 1962-09-12 1962-09-12 Variable cooler unit
FR932833A FR1368142A (en) 1962-09-12 1963-04-26 Device for cooling electronic components

Publications (1)

Publication Number Publication Date
FR1368142A true FR1368142A (en) 1964-07-31

Family

ID=26201004

Family Applications (1)

Application Number Title Priority Date Filing Date
FR932833A Expired FR1368142A (en) 1962-09-12 1963-04-26 Device for cooling electronic components

Country Status (1)

Country Link
FR (1) FR1368142A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1328020A1 (en) * 2002-01-10 2003-07-16 Wen-Chen Wei Fin piece structure for heat dissipater

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1328020A1 (en) * 2002-01-10 2003-07-16 Wen-Chen Wei Fin piece structure for heat dissipater

Similar Documents

Publication Publication Date Title
FR1517244A (en) Cooling device for fans
FR1406719A (en) Cooling device
FR1339517A (en) Anti-foaming device for tractor-trailer
FR1304758A (en) Advanced device for moving vehicles
FR1368142A (en) Device for cooling electronic components
FR87466E (en) Selection device for electrical circuits or equipment
FR1332718A (en) Device for making equipment incorporated in an assembly accessible
FR1374649A (en) Cooling device for transformer
FR1366322A (en) Device for tele-radiological examinations
FR1305827A (en) Cooling device for electrical machines
FR1327550A (en) Cooling system for electronic devices
FR1336320A (en) Device for the sharing in equal parts of cakes
FR1389191A (en) Cooling device for electrical components
FR1362298A (en) Protection device for electrical components
FR1422820A (en) Semiconductor device mount
FR1343850A (en) Lubrication device
FR1320199A (en) Cooling device for semiconductor element
FR1334891A (en) Radar device for vehicles
FR1421237A (en) Locking device for removable circuit breakers
FR1438171A (en) Electronic component support device
FR1351861A (en) Device for ranking cards
FR1324587A (en) Cooling device for vehicle brakes
FR1340515A (en) Breakdown detection device for unidirectional circuits
FR1327896A (en) Staking device for floriculture
FR1342650A (en) Centering device for vehicles