FR1357600A - Support pour connexions électriques intégrées - Google Patents

Support pour connexions électriques intégrées

Info

Publication number
FR1357600A
FR1357600A FR936870A FR936870A FR1357600A FR 1357600 A FR1357600 A FR 1357600A FR 936870 A FR936870 A FR 936870A FR 936870 A FR936870 A FR 936870A FR 1357600 A FR1357600 A FR 1357600A
Authority
FR
France
Prior art keywords
support
electrical connections
integrated electrical
integrated
connections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR936870A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US200574A external-priority patent/US3248474A/en
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Priority to FR936870A priority Critical patent/FR1357600A/fr
Application granted granted Critical
Publication of FR1357600A publication Critical patent/FR1357600A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0271—Mechanical force other than pressure, e.g. shearing or pulling

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
FR936870A 1962-06-06 1963-06-04 Support pour connexions électriques intégrées Expired FR1357600A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR936870A FR1357600A (fr) 1962-06-06 1963-06-04 Support pour connexions électriques intégrées

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US200574A US3248474A (en) 1962-06-06 1962-06-06 Substrate for integrated electrical connections
FR936870A FR1357600A (fr) 1962-06-06 1963-06-04 Support pour connexions électriques intégrées

Publications (1)

Publication Number Publication Date
FR1357600A true FR1357600A (fr) 1964-04-03

Family

ID=26201658

Family Applications (1)

Application Number Title Priority Date Filing Date
FR936870A Expired FR1357600A (fr) 1962-06-06 1963-06-04 Support pour connexions électriques intégrées

Country Status (1)

Country Link
FR (1) FR1357600A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0040190A1 (fr) * 1979-11-16 1981-11-25 Robert Bogardus Lomerson Procede de metallisation de trous dans un materiau isolant.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0040190A1 (fr) * 1979-11-16 1981-11-25 Robert Bogardus Lomerson Procede de metallisation de trous dans un materiau isolant.
EP0040190A4 (fr) * 1979-11-16 1984-09-24 Robert Bogardus Lomerson Procede de metallisation de trous dans un materiau isolant.

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