FR1347121A - Improvements to sealed enclosures for piezoelectric crystals - Google Patents
Improvements to sealed enclosures for piezoelectric crystalsInfo
- Publication number
- FR1347121A FR1347121A FR915079A FR915079A FR1347121A FR 1347121 A FR1347121 A FR 1347121A FR 915079 A FR915079 A FR 915079A FR 915079 A FR915079 A FR 915079A FR 1347121 A FR1347121 A FR 1347121A
- Authority
- FR
- France
- Prior art keywords
- piezoelectric crystals
- sealed enclosures
- enclosures
- sealed
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR915079A FR1347121A (en) | 1962-11-12 | 1962-11-12 | Improvements to sealed enclosures for piezoelectric crystals |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR915079A FR1347121A (en) | 1962-11-12 | 1962-11-12 | Improvements to sealed enclosures for piezoelectric crystals |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1347121A true FR1347121A (en) | 1963-12-27 |
Family
ID=8790573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR915079A Expired FR1347121A (en) | 1962-11-12 | 1962-11-12 | Improvements to sealed enclosures for piezoelectric crystals |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1347121A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0018250A1 (en) * | 1979-04-18 | 1980-10-29 | Compagnie D'electronique Et De Piezo-Electricite - C.E.P.E. | Encapsulation housing for an electronic component, and component comprising such a housing |
FR2568443A1 (en) * | 1984-07-27 | 1986-01-31 | Cepe | COLD-CLOSING BOX SUPPORTING HIGH TEMPERATURES |
-
1962
- 1962-11-12 FR FR915079A patent/FR1347121A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0018250A1 (en) * | 1979-04-18 | 1980-10-29 | Compagnie D'electronique Et De Piezo-Electricite - C.E.P.E. | Encapsulation housing for an electronic component, and component comprising such a housing |
FR2568443A1 (en) * | 1984-07-27 | 1986-01-31 | Cepe | COLD-CLOSING BOX SUPPORTING HIGH TEMPERATURES |
EP0172769A1 (en) * | 1984-07-27 | 1986-02-26 | Compagnie D'electronique Et De Piezo-Electricite - C.E.P.E. | Case sealed by cold-welding and withstanding high temperatures |
US4686324A (en) * | 1984-07-27 | 1987-08-11 | Compagnie D'electronique Et De Piezo-Electricite | Cold-seal package for withstanding high temperatures |
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