FR1310995A - Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation - Google Patents
Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparationInfo
- Publication number
- FR1310995A FR1310995A FR885160A FR885160A FR1310995A FR 1310995 A FR1310995 A FR 1310995A FR 885160 A FR885160 A FR 885160A FR 885160 A FR885160 A FR 885160A FR 1310995 A FR1310995 A FR 1310995A
- Authority
- FR
- France
- Prior art keywords
- preparation
- regeneration
- nickel
- electric current
- plating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR885160A FR1310995A (en) | 1962-01-18 | 1962-01-18 | Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR885160A FR1310995A (en) | 1962-01-18 | 1962-01-18 | Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1310995A true FR1310995A (en) | 1962-11-30 |
Family
ID=8770695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR885160A Expired FR1310995A (en) | 1962-01-18 | 1962-01-18 | Concentrated product for the preparation and regeneration of a nickel-plating bath without electric current and process for its preparation |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1310995A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0692554A1 (en) * | 1994-07-14 | 1996-01-17 | Matsushita Electric Industrial Co., Ltd. | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device |
-
1962
- 1962-01-18 FR FR885160A patent/FR1310995A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0692554A1 (en) * | 1994-07-14 | 1996-01-17 | Matsushita Electric Industrial Co., Ltd. | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device |
US5645628A (en) * | 1994-07-14 | 1997-07-08 | Matsushita Electric Industrial Co., Ltd. | Electroless plating bath used for forming a wiring of a semiconductor device, and method of forming a wiring of a semiconductor device |
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