FR1305188A - Method for joining an electrode of a semiconductor device with a contact piece - Google Patents
Method for joining an electrode of a semiconductor device with a contact pieceInfo
- Publication number
- FR1305188A FR1305188A FR878610A FR878610A FR1305188A FR 1305188 A FR1305188 A FR 1305188A FR 878610 A FR878610 A FR 878610A FR 878610 A FR878610 A FR 878610A FR 1305188 A FR1305188 A FR 1305188A
- Authority
- FR
- France
- Prior art keywords
- joining
- electrode
- semiconductor device
- contact piece
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR878610A FR1305188A (en) | 1960-11-16 | 1961-11-10 | Method for joining an electrode of a semiconductor device with a contact piece |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0071282 | 1960-11-16 | ||
FR878610A FR1305188A (en) | 1960-11-16 | 1961-11-10 | Method for joining an electrode of a semiconductor device with a contact piece |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1305188A true FR1305188A (en) | 1962-09-28 |
Family
ID=25996267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR878610A Expired FR1305188A (en) | 1960-11-16 | 1961-11-10 | Method for joining an electrode of a semiconductor device with a contact piece |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1305188A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2235752A1 (en) * | 1973-07-06 | 1975-01-31 | Honeywell Bull Soc Ind | Indium-lead solder for gold - useful for semiconductor devices |
FR2306528A1 (en) * | 1975-03-31 | 1976-10-29 | Gen Electric | BINDING PROCESS OF A METAL AND A SEMICONDUCTOR |
-
1961
- 1961-11-10 FR FR878610A patent/FR1305188A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2235752A1 (en) * | 1973-07-06 | 1975-01-31 | Honeywell Bull Soc Ind | Indium-lead solder for gold - useful for semiconductor devices |
FR2306528A1 (en) * | 1975-03-31 | 1976-10-29 | Gen Electric | BINDING PROCESS OF A METAL AND A SEMICONDUCTOR |
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