FR1302710A - protective element for hermetically sealed semiconductor devices - Google Patents
protective element for hermetically sealed semiconductor devicesInfo
- Publication number
- FR1302710A FR1302710A FR874790A FR874790A FR1302710A FR 1302710 A FR1302710 A FR 1302710A FR 874790 A FR874790 A FR 874790A FR 874790 A FR874790 A FR 874790A FR 1302710 A FR1302710 A FR 1302710A
- Authority
- FR
- France
- Prior art keywords
- semiconductor devices
- hermetically sealed
- protective element
- sealed semiconductor
- protective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR874790A FR1302710A (en) | 1960-12-01 | 1961-10-02 | protective element for hermetically sealed semiconductor devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73140A US3083320A (en) | 1960-12-01 | 1960-12-01 | Protective element for hermetically enclosed semiconductor devices |
FR874790A FR1302710A (en) | 1960-12-01 | 1961-10-02 | protective element for hermetically sealed semiconductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1302710A true FR1302710A (en) | 1962-08-31 |
Family
ID=26192524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR874790A Expired FR1302710A (en) | 1960-12-01 | 1961-10-02 | protective element for hermetically sealed semiconductor devices |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1302710A (en) |
-
1961
- 1961-10-02 FR FR874790A patent/FR1302710A/en not_active Expired
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