FR1243720A - Système de circuit électrique tridimensionnel et unités modulaires utilisées dans ce système - Google Patents

Système de circuit électrique tridimensionnel et unités modulaires utilisées dans ce système

Info

Publication number
FR1243720A
FR1243720A FR814269A FR814269A FR1243720A FR 1243720 A FR1243720 A FR 1243720A FR 814269 A FR814269 A FR 814269A FR 814269 A FR814269 A FR 814269A FR 1243720 A FR1243720 A FR 1243720A
Authority
FR
France
Prior art keywords
electrical circuit
units used
modular units
dimensional electrical
circuit system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR814269A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of FR1243720A publication Critical patent/FR1243720A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/514—Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/20—Bus-bar or other wiring layouts, e.g. in cubicles, in switchyards
    • H02B1/207—Cross-bar layouts
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B15/00—Supervisory desks or panels for centralised control or display
    • H02B15/02—Supervisory desks or panels for centralised control or display with mimic diagrams
    • H02B15/04—Supervisory desks or panels for centralised control or display with mimic diagrams consisting of building blocks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/023—Stackable modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439—Back panel mother boards
    • H05K7/1444—Complex or three-dimensional-arrangements; Stepped or dual mother boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/928—Modular electrically interengaging parts, e.g. stove with replaceable heating elements formed on coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Installation Of Bus-Bars (AREA)
FR814269A 1958-12-29 1959-12-28 Système de circuit électrique tridimensionnel et unités modulaires utilisées dans ce système Expired FR1243720A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78329658A 1958-12-29 1958-12-29

Publications (1)

Publication Number Publication Date
FR1243720A true FR1243720A (fr) 1960-10-14

Family

ID=25128784

Family Applications (1)

Application Number Title Priority Date Filing Date
FR814269A Expired FR1243720A (fr) 1958-12-29 1959-12-28 Système de circuit électrique tridimensionnel et unités modulaires utilisées dans ce système

Country Status (6)

Country Link
US (1) US3264525A (fr)
CH (2) CH387125A (fr)
DE (1) DE1861066U (fr)
FR (1) FR1243720A (fr)
GB (1) GB866528A (fr)
SE (1) SE313611B (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3164750A (en) * 1965-01-05 miller
US3368115A (en) * 1965-10-19 1968-02-06 Amp Inc Modular housing for integrated circuit structure with improved interconnection means
US3441853A (en) * 1966-06-21 1969-04-29 Signetics Corp Plug-in integrated circuit package and carrier assembly and including a test fixture therefor
US3699496A (en) * 1968-03-25 1972-10-17 Us Army Switching matrix
US3533045A (en) * 1968-05-29 1970-10-06 Amp Inc Supporting and keying means for printed circuit boards or the like
US3614541A (en) * 1969-04-08 1971-10-19 North American Rockwell Package for an electronic assembly
JPS4942460U (fr) * 1972-07-18 1974-04-13
JPS4942459U (fr) * 1972-07-18 1974-04-13
US4574331A (en) * 1983-05-31 1986-03-04 Trw Inc. Multi-element circuit construction
USRE32290E (en) * 1983-06-17 1986-11-18 Amp Incorporated Input/output intercard connector
US4506940A (en) * 1983-06-17 1985-03-26 Amp Incorporated Input/output intercard connector
US4517625A (en) * 1983-11-09 1985-05-14 Lockheed Corporation Circuit board housing with zero insertion force connector
US4619490A (en) * 1984-12-18 1986-10-28 Raychem Corporation Guidance and retention device and connector assembly
US4800463A (en) * 1985-12-05 1989-01-24 Tandem Computers Incorporated Circuit board barrier guide
US4700275A (en) * 1986-06-23 1987-10-13 Tektronix, Inc. Modularized electronic instrument packaging system
US4834660A (en) * 1987-06-03 1989-05-30 Harris Corporation Flexible zero insertion force interconnector between circuit boards
DE3720925A1 (de) * 1987-06-25 1989-01-05 Wabco Westinghouse Fahrzeug Leiterplatte
US4818241A (en) * 1987-11-09 1989-04-04 Bell Communications Research, Inc. Electrical interconnection device using elastomeric strips
US5309315A (en) * 1991-08-09 1994-05-03 Pulse Embedded Computer Systems, Inc. Severe environment enclosure with thermal heat sink and EMI protection
US5727961A (en) * 1996-04-30 1998-03-17 The Whitaker Corporation Two-way transversely matable electrical connector
US6183301B1 (en) 1997-01-16 2001-02-06 Berg Technology, Inc. Surface mount connector with integrated PCB assembly
KR100355753B1 (ko) * 2000-11-03 2002-10-19 주식회사 글로텍 보드용 커넥터
CN200959416Y (zh) * 2006-09-15 2007-10-10 富士康(昆山)电脑接插件有限公司 电连接器
US9673179B1 (en) * 2016-07-20 2017-06-06 International Business Machines Corporation Discrete electronic device embedded in chip module
GB2571907A (en) 2018-01-16 2019-09-18 Smethurst Nicholas Configurable modular computer enclosure

Also Published As

Publication number Publication date
GB866528A (en) 1961-04-26
CH439445A (de) 1967-07-15
SE313611B (fr) 1969-08-18
CH387125A (de) 1965-01-31
US3264525A (en) 1966-08-02
DE1861066U (de) 1962-10-31

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