FR1243389A - Procédé pour doter des semi-conducteurs avec établissement éventuel de contacts - Google Patents

Procédé pour doter des semi-conducteurs avec établissement éventuel de contacts

Info

Publication number
FR1243389A
FR1243389A FR814251A FR814251A FR1243389A FR 1243389 A FR1243389 A FR 1243389A FR 814251 A FR814251 A FR 814251A FR 814251 A FR814251 A FR 814251A FR 1243389 A FR1243389 A FR 1243389A
Authority
FR
France
Prior art keywords
contacts
possible establishment
semiconductors
providing
providing semiconductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR814251A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Application granted granted Critical
Publication of FR1243389A publication Critical patent/FR1243389A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/42—Electroplating: Baths therefor from solutions of light metals
    • C25D3/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
    • C30B31/04—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion materials in the liquid state
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Weting (AREA)
FR814251A 1959-01-12 1959-12-28 Procédé pour doter des semi-conducteurs avec établissement éventuel de contacts Expired FR1243389A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0061298 1959-01-12

Publications (1)

Publication Number Publication Date
FR1243389A true FR1243389A (fr) 1960-10-07

Family

ID=7494749

Family Applications (1)

Application Number Title Priority Date Filing Date
FR814251A Expired FR1243389A (fr) 1959-01-12 1959-12-28 Procédé pour doter des semi-conducteurs avec établissement éventuel de contacts

Country Status (7)

Country Link
US (2) US3261773A (US07943777-20110517-C00090.png)
BE (1) BE586196A (US07943777-20110517-C00090.png)
CH (1) CH387410A (US07943777-20110517-C00090.png)
FR (1) FR1243389A (US07943777-20110517-C00090.png)
GB (1) GB945949A (US07943777-20110517-C00090.png)
NL (2) NL247276A (US07943777-20110517-C00090.png)
SE (1) SE304659B (US07943777-20110517-C00090.png)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL297836A (US07943777-20110517-C00090.png) * 1962-09-14
US3345274A (en) * 1964-04-22 1967-10-03 Westinghouse Electric Corp Method of making oxide film patterns
US3345275A (en) * 1964-04-28 1967-10-03 Westinghouse Electric Corp Electrolyte and diffusion process
US3506887A (en) * 1966-02-23 1970-04-14 Motorola Inc Semiconductor device and method of making same
US3492167A (en) * 1966-08-26 1970-01-27 Matsushita Electric Ind Co Ltd Photovoltaic cell and method of making the same
US4032418A (en) * 1975-01-16 1977-06-28 Jovan Antula Method of introducing impurities into a semiconductor
US4193847A (en) * 1978-09-05 1980-03-18 Polaroid Corporation Method of electrodeposition
GB2117775A (en) * 1981-11-25 1983-10-19 Secr Defence Organometallic adducts and their use in the preparation of compound semiconductor materials
US5227041A (en) * 1992-06-12 1993-07-13 Digital Equipment Corporation Dry contact electroplating apparatus
US5276242A (en) * 1992-08-26 1994-01-04 Phillips Petroleum Company Alkylation process
JP3376258B2 (ja) * 1996-11-28 2003-02-10 キヤノン株式会社 陽極化成装置及びそれに関連する装置及び方法
US6482307B2 (en) 2000-05-12 2002-11-19 Nutool, Inc. Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA602461A (en) * 1960-07-26 H. Claussen Brian Manufacture of semi-conductor devices
US2846346A (en) * 1954-03-26 1958-08-05 Philco Corp Semiconductor device
US2876184A (en) * 1954-06-02 1959-03-03 Motorola Inc Transistor process and apparatus
NL108205C (US07943777-20110517-C00090.png) * 1954-09-27
US2890160A (en) * 1954-11-08 1959-06-09 Philips Corp Fixture suspending phonograph record blank
BE540052A (US07943777-20110517-C00090.png) * 1955-06-13
US2945789A (en) * 1955-11-25 1960-07-19 Philco Corp Method for fabricating metal-semiconductor alloyed regions
US2823175A (en) * 1956-11-14 1958-02-11 Philco Corp Semiconductive devices
GB807297A (en) * 1957-02-22 1959-01-14 Standard Telephones Cables Ltd Improvements in or relating to the manufacture of semi-conductor devices
US2857321A (en) * 1957-03-15 1958-10-21 Raytheon Mfg Co Methods of soldering to aluminum or other material having surface-oxide film
US2987460A (en) * 1958-10-21 1961-06-06 United States Steel Corp Holder for sheet-metal sample
US3075892A (en) * 1959-09-15 1963-01-29 Westinghouse Electric Corp Process for making semiconductor devices

Also Published As

Publication number Publication date
US3261773A (en) 1966-07-19
GB945949A (en) 1964-01-08
NL133277C (US07943777-20110517-C00090.png)
CH387410A (de) 1965-01-31
US3328272A (en) 1967-06-27
BE586196A (fr) 1960-04-19
SE304659B (US07943777-20110517-C00090.png) 1968-09-30
NL247276A (US07943777-20110517-C00090.png)

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