FR1213484A - Non-isotropic conductive medium for intense heat flow - Google Patents

Non-isotropic conductive medium for intense heat flow

Info

Publication number
FR1213484A
FR1213484A FR1213484DA FR1213484A FR 1213484 A FR1213484 A FR 1213484A FR 1213484D A FR1213484D A FR 1213484DA FR 1213484 A FR1213484 A FR 1213484A
Authority
FR
France
Prior art keywords
heat flow
conductive medium
intense heat
isotropic conductive
isotropic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Application granted granted Critical
Publication of FR1213484A publication Critical patent/FR1213484A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Secondary Cells (AREA)
FR1213484D 1958-08-04 1958-08-04 Non-isotropic conductive medium for intense heat flow Expired FR1213484A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR771797 1958-08-04

Publications (1)

Publication Number Publication Date
FR1213484A true FR1213484A (en) 1960-04-01

Family

ID=8707174

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1213484D Expired FR1213484A (en) 1958-08-04 1958-08-04 Non-isotropic conductive medium for intense heat flow

Country Status (3)

Country Link
DE (1) DE1247489B (en)
FR (1) FR1213484A (en)
GB (1) GB896989A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1226715B (en) * 1961-02-15 1966-10-13 Philips Patentverwaltung Semiconductor component with a surface-like semiconductor element soldered to power supply lines and method for its manufacture
DE1240995B (en) * 1960-11-02 1967-05-24 Siemens Ag Method for contacting an electrode of a semiconductor element with an electrical connection conductor
DE1254251B (en) * 1963-10-11 1967-11-16 American Mach & Foundry Semiconductor component
DE1254773B (en) * 1960-11-02 1967-11-23 Siemens Ag Connection body for semiconductor components
EP0012019A1 (en) * 1978-12-01 1980-06-11 Hitachi, Ltd. An electrode for a semiconductor device and method of making such an electrode
US4879891A (en) * 1987-04-27 1989-11-14 Thermalloy Incorporated Method of manufacturing heat sink apparatus
US4884331A (en) * 1987-04-27 1989-12-05 Thermalloy Incorporated Method of manufacturing heat sink apparatus

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007019885B4 (en) * 2007-04-27 2010-11-25 Wieland-Werke Ag Heatsink with matrix-structured surface

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2362911A (en) * 1942-10-05 1944-11-14 Int Standard Electric Corp Liquid cooling of high temperature bodies
GB625179A (en) * 1947-02-17 1949-06-23 M O Valve Co Ltd Improvements in or relating to the cooling of electric discharge devices

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1240995B (en) * 1960-11-02 1967-05-24 Siemens Ag Method for contacting an electrode of a semiconductor element with an electrical connection conductor
DE1254773B (en) * 1960-11-02 1967-11-23 Siemens Ag Connection body for semiconductor components
DE1226715B (en) * 1961-02-15 1966-10-13 Philips Patentverwaltung Semiconductor component with a surface-like semiconductor element soldered to power supply lines and method for its manufacture
DE1254251B (en) * 1963-10-11 1967-11-16 American Mach & Foundry Semiconductor component
EP0012019A1 (en) * 1978-12-01 1980-06-11 Hitachi, Ltd. An electrode for a semiconductor device and method of making such an electrode
US4879891A (en) * 1987-04-27 1989-11-14 Thermalloy Incorporated Method of manufacturing heat sink apparatus
US4884331A (en) * 1987-04-27 1989-12-05 Thermalloy Incorporated Method of manufacturing heat sink apparatus

Also Published As

Publication number Publication date
GB896989A (en) 1962-05-23
DE1247489B (en) 1967-08-17

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