FR1206000A - Cooling fin - Google Patents

Cooling fin

Info

Publication number
FR1206000A
FR1206000A FR1206000DA FR1206000A FR 1206000 A FR1206000 A FR 1206000A FR 1206000D A FR1206000D A FR 1206000DA FR 1206000 A FR1206000 A FR 1206000A
Authority
FR
France
Prior art keywords
cooling fin
fin
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Industrielle de Liaisons Electriques SA
Original Assignee
Societe Industrielle de Liaisons Electriques SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Industrielle de Liaisons Electriques SA filed Critical Societe Industrielle de Liaisons Electriques SA
Application granted granted Critical
Publication of FR1206000A publication Critical patent/FR1206000A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FR1206000D 1958-04-29 1958-04-29 Cooling fin Expired FR1206000A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1206000T 1958-04-29

Publications (1)

Publication Number Publication Date
FR1206000A true FR1206000A (en) 1960-02-05

Family

ID=9673423

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1206000D Expired FR1206000A (en) 1958-04-29 1958-04-29 Cooling fin

Country Status (1)

Country Link
FR (1) FR1206000A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3280907A (en) * 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
US3325582A (en) * 1964-08-27 1967-06-13 Bosch Gmbh Robert Arrangement for supporting and for conducting heat away from a semiconductor element in a capsule of electrically conductive material
US4638854A (en) * 1983-06-15 1987-01-27 Noren Don W Heat pipe assembly
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3325582A (en) * 1964-08-27 1967-06-13 Bosch Gmbh Robert Arrangement for supporting and for conducting heat away from a semiconductor element in a capsule of electrically conductive material
US3280907A (en) * 1964-09-01 1966-10-25 Hoffman Sidney Energy transfer device
US4638854A (en) * 1983-06-15 1987-01-27 Noren Don W Heat pipe assembly
US5794685A (en) * 1996-12-17 1998-08-18 Hewlett-Packard Company Heat sink device having radial heat and airflow paths

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