FR1109406A - Redresseur - Google Patents

Redresseur

Info

Publication number
FR1109406A
FR1109406A FR1109406DA FR1109406A FR 1109406 A FR1109406 A FR 1109406A FR 1109406D A FR1109406D A FR 1109406DA FR 1109406 A FR1109406 A FR 1109406A
Authority
FR
France
Prior art keywords
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Application granted granted Critical
Publication of FR1109406A publication Critical patent/FR1109406A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
FR1109406D 1953-03-20 1954-03-19 Redresseur Expired FR1109406A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US343588A US2730663A (en) 1953-03-20 1953-03-20 Unilaterally conductive device

Publications (1)

Publication Number Publication Date
FR1109406A true FR1109406A (fr) 1956-01-27

Family

ID=23346714

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1109406D Expired FR1109406A (fr) 1953-03-20 1954-03-19 Redresseur

Country Status (3)

Country Link
US (1) US2730663A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BE (1) BE527420A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR1109406A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL204333A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1954-01-14 1900-01-01
NL192214A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1954-01-21
NL190331A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1954-08-26 1900-01-01
DE1066666B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1954-12-16 1959-10-08
US2849665A (en) * 1955-10-17 1958-08-26 Westinghouse Electric Corp Ultra high power transistor
US3011067A (en) * 1955-10-25 1961-11-28 Purdue Research Foundation Semiconductor rectifying device having non-rectifying electrodes
US2889498A (en) * 1955-11-08 1959-06-02 Westinghouse Electric Corp Semiconductor rectifier assembly
BE557039A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1956-04-27
BE563189A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1956-06-08
CH344786A (de) * 1956-06-29 1960-02-29 Bbc Brown Boveri & Cie Kühler für die Wärmeableitung an einer in einem Gefäss eingebauten Halbleiterzelle
US3018539A (en) * 1956-11-06 1962-01-30 Motorola Inc Diffused base transistor and method of making same
US2876399A (en) * 1957-04-24 1959-03-03 Gen Electric Semiconductor devices
US3109234A (en) * 1957-07-22 1963-11-05 Rca Corp Method of mounting a semiconductor device
US2974263A (en) * 1958-01-06 1961-03-07 Marquette Corp Heat sink and diode assembly
US3150298A (en) * 1958-04-16 1964-09-22 Motorola Inc Stud-mounted rectifier
US2965819A (en) * 1958-08-07 1960-12-20 Rosenbaum Jacob Heat dissipating electronic mounting apparatus
US3054032A (en) * 1958-11-17 1962-09-11 Rolland C Sabins Heat sink for a. c.-d. c. rectifier
US3025436A (en) * 1959-08-19 1962-03-13 Itt High current rectifier
GB958044A (en) * 1961-05-04 1964-05-13 Westinghouse Brake & Signal Improvements relating to rectifier mountings
BE630876A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1962-08-29
US3377524A (en) * 1965-09-30 1968-04-09 Gen Electric Mounting arrangement for semiconductor devices
DE1283404B (de) * 1967-02-16 1968-11-21 Philips Patentverwertung Gmbh Kuehlkoerperanordnung zur Kontaktkuehlung fuer elektrische Entladungsroehren
DE2638909A1 (de) * 1976-08-28 1978-03-02 Semikron Gleichrichterbau Halbleiteranordnung
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1723584A (en) * 1929-08-06 Rectifying device

Also Published As

Publication number Publication date
US2730663A (en) 1956-01-10
BE527420A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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