FR1083816A - Improvements to sealed mounts for semiconductor rectifiers - Google Patents

Improvements to sealed mounts for semiconductor rectifiers

Info

Publication number
FR1083816A
FR1083816A FR1083816DA FR1083816A FR 1083816 A FR1083816 A FR 1083816A FR 1083816D A FR1083816D A FR 1083816DA FR 1083816 A FR1083816 A FR 1083816A
Authority
FR
France
Prior art keywords
semiconductor rectifiers
mounts
sealed
sealed mounts
rectifiers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Application granted granted Critical
Publication of FR1083816A publication Critical patent/FR1083816A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/044—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of glass, glass-ceramic or ceramic material only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/32—Sealing leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
FR1083816D 1952-09-19 1953-09-18 Improvements to sealed mounts for semiconductor rectifiers Expired FR1083816A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1083816X 1952-09-19

Publications (1)

Publication Number Publication Date
FR1083816A true FR1083816A (en) 1955-01-12

Family

ID=10872822

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1083816D Expired FR1083816A (en) 1952-09-19 1953-09-18 Improvements to sealed mounts for semiconductor rectifiers

Country Status (1)

Country Link
FR (1) FR1083816A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225767C2 (en) * 1962-03-15 1974-11-14 METHOD OF ASSEMBLING A SEMICONDUCTOR DIODE

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1225767C2 (en) * 1962-03-15 1974-11-14 METHOD OF ASSEMBLING A SEMICONDUCTOR DIODE
DE1225767B (en) * 1962-03-15 1974-11-14 METHOD OF ASSEMBLING A SEMICONDUCTOR DIODE

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