FR1081675A - Cooling device dry rectifier using liquid cooling medium - Google Patents

Cooling device dry rectifier using liquid cooling medium

Info

Publication number
FR1081675A
FR1081675A FR1081675DA FR1081675A FR 1081675 A FR1081675 A FR 1081675A FR 1081675D A FR1081675D A FR 1081675DA FR 1081675 A FR1081675 A FR 1081675A
Authority
FR
France
Prior art keywords
device dry
dry rectifier
cooling device
cooling medium
liquid cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens AG
Original Assignee
Siemens Schuckertwerke AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens AG filed Critical Siemens Schuckertwerke AG
Application granted granted Critical
Publication of FR1081675A publication Critical patent/FR1081675A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Rectifiers (AREA)
FR1081675D 1952-08-27 1953-07-28 Cooling device dry rectifier using liquid cooling medium Expired FR1081675A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1952S0029953 DE967450C (en) 1952-08-27 1952-08-27 Cooling device for dry rectifier with cooling ducts

Publications (1)

Publication Number Publication Date
FR1081675A true FR1081675A (en) 1954-12-22

Family

ID=6152300

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1081675D Expired FR1081675A (en) 1952-08-27 1953-07-28 Cooling device dry rectifier using liquid cooling medium

Country Status (4)

Country Link
CH (1) CH319751A (en)
DE (1) DE967450C (en)
FR (1) FR1081675A (en)
GB (1) GB758524A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2766409A (en) * 1955-02-28 1956-10-09 Internatioanl Rectifier Corp Fluid cooled encapsulated rectifier stack
US2783418A (en) * 1954-06-22 1957-02-26 Westinghouse Brake & Signal Metal rectifiers
US2815472A (en) * 1954-12-21 1957-12-03 Gen Electric Rectifier unit
DE1034723B (en) * 1955-07-15 1958-07-24 Siemens Edison Swan Ltd Electronic device with a device to dissipate the heat generated in the device

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE974194C (en) * 1953-04-02 1960-10-13 Standard Elek K Lorenz Ag Process for making barrier cells of very small effective area
US3054032A (en) * 1958-11-17 1962-09-11 Rolland C Sabins Heat sink for a. c.-d. c. rectifier
US3800190A (en) * 1970-11-02 1974-03-26 Bbc Brown Boveri & Cie Cooling system for power semiconductor devices
DE2160302C3 (en) * 1971-12-04 1975-07-17 Siemens Ag Cooling box for installation in disc cell stacks
JPS5610948A (en) * 1979-07-06 1981-02-03 Hitachi Ltd Water cooling fin for semiconductor element
DE3683034D1 (en) * 1986-01-16 1992-01-30 Siemens Ag DEVICE FOR A LIQUID COOLING OF AN ELECTRICAL COMPONENT, IN PARTICULAR SEMICONDUCTOR COMPONENT.
CH677293A5 (en) * 1989-01-16 1991-04-30 Asea Brown Boveri Power semiconductor heat sink - has meandering flow path containing insulating hose filled with cooling fluid
WO1995017765A2 (en) * 1993-12-15 1995-06-29 Aavid Engineering, Inc. Liquid cooled heat sink for cooling electronic components
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
JP4048579B2 (en) * 1997-08-28 2008-02-20 住友電気工業株式会社 Heat dissipating body including refrigerant flow path and manufacturing method thereof
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US7017651B1 (en) * 2000-09-13 2006-03-28 Raytheon Company Method and apparatus for temperature gradient control in an electronic system
US6351381B1 (en) 2001-06-20 2002-02-26 Thermal Corp. Heat management system
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
DE102004057432B4 (en) * 2004-11-27 2006-10-19 Rittal Gmbh & Co. Kg cooling unit
EP1891672A2 (en) * 2005-03-22 2008-02-27 Bharat Heavy Electricals Lilmited Selectively grooved cold plate for electronics cooling
EP3459110B1 (en) * 2016-07-01 2020-08-26 Siemens Aktiengesellschaft Cooling box unit and power electronics device having a cooling box unit
DE102018204588B4 (en) * 2018-03-26 2019-10-10 TRUMPF Hüttinger GmbH + Co. KG Arrangement for cooling components and use of an electrolyte of an electrochemical storage as a coolant in such an arrangement
CN114068275A (en) * 2020-08-05 2022-02-18 中微半导体设备(上海)股份有限公司 Semiconductor component, plasma reaction apparatus, and coating layer forming method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE689105C (en) * 1937-11-03 1940-03-11 Siemens Schuckertwerke Akt Ges Dry rectifier arrangement with tubular rectifier elements

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2783418A (en) * 1954-06-22 1957-02-26 Westinghouse Brake & Signal Metal rectifiers
US2815472A (en) * 1954-12-21 1957-12-03 Gen Electric Rectifier unit
US2766409A (en) * 1955-02-28 1956-10-09 Internatioanl Rectifier Corp Fluid cooled encapsulated rectifier stack
DE1034723B (en) * 1955-07-15 1958-07-24 Siemens Edison Swan Ltd Electronic device with a device to dissipate the heat generated in the device

Also Published As

Publication number Publication date
DE967450C (en) 1957-11-14
CH319751A (en) 1957-02-28
GB758524A (en) 1956-10-03

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