FR1062766A - Procédé pour la constitution d'un alliage sur des surfaces métalliques ou semiconductrices - Google Patents

Procédé pour la constitution d'un alliage sur des surfaces métalliques ou semiconductrices

Info

Publication number
FR1062766A
FR1062766A FR1062766DA FR1062766A FR 1062766 A FR1062766 A FR 1062766A FR 1062766D A FR1062766D A FR 1062766DA FR 1062766 A FR1062766 A FR 1062766A
Authority
FR
France
Prior art keywords
metallic
alloy
forming
semiconductor surfaces
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Application granted granted Critical
Publication of FR1062766A publication Critical patent/FR1062766A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/06Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01032Germanium [Ge]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FR1062766D 1951-09-17 1952-09-08 Procédé pour la constitution d'un alliage sur des surfaces métalliques ou semiconductrices Expired FR1062766A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE753252X 1951-09-17

Publications (1)

Publication Number Publication Date
FR1062766A true FR1062766A (fr) 1954-04-27

Family

ID=6656589

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1062766D Expired FR1062766A (fr) 1951-09-17 1952-09-08 Procédé pour la constitution d'un alliage sur des surfaces métalliques ou semiconductrices

Country Status (2)

Country Link
FR (1) FR1062766A (fr)
GB (1) GB753252A (fr)

Also Published As

Publication number Publication date
GB753252A (en) 1956-07-18

Similar Documents

Publication Publication Date Title
CH315684A (it) Rivestimento protettivo per tubi metallici, procedimento per la sua fabbricazione ed apparecchio per l'attuazione di questo procedimento
CH298516A (fr) Procédé pour le recouvrement électrolytique d'un objet en aluminium ou en alliage d'aluminium.
CH311871A (fr) Procédé pour la production de l'aluminium.
FR1089521A (fr) Procédé perfectionné pour l'obtention de l'hydrazine
FR1083577A (fr) Procédé et solutions pour le dépôt électrolytique de métaux
FR1062766A (fr) Procédé pour la constitution d'un alliage sur des surfaces métalliques ou semiconductrices
FR1066186A (fr) Procédé pour l'obtention d'un revêtement à base d'oxalate sur les métaux
FR1064544A (fr) Procédé pour la production d'hydroxylamine
FR1064876A (fr) Procédé d'obtention d'un alliage d'aluminium
FR1065191A (fr) Procédé pour transformer chimiquement la surface des métaux
FR1043475A (fr) Procédé pour la fabrication d'alliages frittés de métaux durs
BE512826A (fr) Procede pour la preparation d'anesthesiques.
FR1061738A (fr) Procédé pour la préparation d'amines
FR1102946A (fr) Procédé pour la préparation de 2, 4, 6-trinitrochlorobenzène
FR1056203A (fr) Perfectionnements apportés aux procédés pour l'obtention de placages métalliques
FR1047573A (fr) Procédé pour la production d'acrylnitrile
GB717568A (en) Apparatus for the manufacture of centrifugally cast tubular metal articles
FR1058236A (fr) Acier pour la fabrication d'objets résistant à la chaleur
FR1063676A (fr) Procédé pour l'exploitation des gazogènes à coulée
FR1089750A (fr) Procédé pour la production de couches superficielles sur des métaux
FR1048194A (fr) Procédé de fabrication d'objets métalliques
CH307011A (fr) Procédé pour le dépôt électrolytique d'alliages composés principalement de cuivre et d'étain.
FR1044571A (fr) Procédé d'obention d'un revêtement anti-rouille sur métaux ferreux
FR1065032A (fr) Procédé pour l'obtention de nitrocyclooctane
FR1094319A (fr) Procédé pour la formation de couches superficielles sur métaux