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RADIOELECTRIQUES LAB
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RADIOELECTRIQUES LAB
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Application filed by RADIOELECTRIQUES LABfiledCriticalRADIOELECTRIQUES LAB
Application grantedgrantedCritical
Publication of FR1003233ApublicationCriticalpatent/FR1003233A/fr
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
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Engineering & Computer Science
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Mechanical Engineering
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FR1003233D1946-12-201946-12-20Procédé d'assemblage étanche de pièces métalliques
ExpiredFR1003233A
(fr)