FI945444A - Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi - Google Patents

Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi Download PDF

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Publication number
FI945444A
FI945444A FI945444A FI945444A FI945444A FI 945444 A FI945444 A FI 945444A FI 945444 A FI945444 A FI 945444A FI 945444 A FI945444 A FI 945444A FI 945444 A FI945444 A FI 945444A
Authority
FI
Finland
Prior art keywords
gild
circuit board
mount holes
coated circuit
processing dip
Prior art date
Application number
FI945444A
Other languages
English (en)
Swedish (sv)
Other versions
FI945444A0 (fi
FI109642B (fi
Inventor
Timo Laensilahti
Original Assignee
Icl Personal Systems Oy
Nokia Telecommunications Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Icl Personal Systems Oy, Nokia Telecommunications Oy filed Critical Icl Personal Systems Oy
Priority to FI945444A priority Critical patent/FI109642B/fi
Publication of FI945444A0 publication Critical patent/FI945444A0/fi
Priority to GB9523567A priority patent/GB2295114B/en
Priority to DE19543021A priority patent/DE19543021A1/de
Publication of FI945444A publication Critical patent/FI945444A/fi
Application granted granted Critical
Publication of FI109642B publication Critical patent/FI109642B/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09572—Solder filled plated through-hole in the final product
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FI945444A 1994-11-18 1994-11-18 Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi FI109642B (fi)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FI945444A FI109642B (fi) 1994-11-18 1994-11-18 Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi
GB9523567A GB2295114B (en) 1994-11-18 1995-11-17 Method and means for treating the through holes of immersion gold plated printed circuit boards
DE19543021A DE19543021A1 (de) 1994-11-18 1995-11-18 Verfahren und Mittel zur Behandlung von Durchkontaktlöchern in mit Tauchvergoldung beschichteten Leiterplatten

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI945444 1994-11-18
FI945444A FI109642B (fi) 1994-11-18 1994-11-18 Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi

Publications (3)

Publication Number Publication Date
FI945444A0 FI945444A0 (fi) 1994-11-18
FI945444A true FI945444A (fi) 1996-05-19
FI109642B FI109642B (fi) 2002-09-13

Family

ID=8541829

Family Applications (1)

Application Number Title Priority Date Filing Date
FI945444A FI109642B (fi) 1994-11-18 1994-11-18 Menetelmä ja välineet kastokultauspinnoitettujen piirilevyjen läpivientiasennusreikien käsittelemiseksi

Country Status (3)

Country Link
DE (1) DE19543021A1 (fi)
FI (1) FI109642B (fi)
GB (1) GB2295114B (fi)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4029168B2 (ja) 2003-02-18 2008-01-09 株式会社村田製作所 電子部品の製造方法
US10172243B2 (en) 2016-11-14 2019-01-01 International Business Machines Corporation Printed circuit board and methods to enhance reliability

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2257386B (en) * 1991-06-24 1995-07-05 Tani Denki Kogyo Kk Screen printing apparatus

Also Published As

Publication number Publication date
GB2295114A (en) 1996-05-22
GB9523567D0 (en) 1996-01-17
DE19543021A1 (de) 1996-05-23
FI945444A0 (fi) 1994-11-18
GB2295114B (en) 1998-07-08
FI109642B (fi) 2002-09-13

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