FI891740L - Foerfarande foer avskiktande av fotolack. - Google Patents

Foerfarande foer avskiktande av fotolack. Download PDF

Info

Publication number
FI891740L
FI891740L FI891740A FI891740A FI891740L FI 891740 L FI891740 L FI 891740L FI 891740 A FI891740 A FI 891740A FI 891740 A FI891740 A FI 891740A FI 891740 L FI891740 L FI 891740L
Authority
FI
Finland
Prior art keywords
avskiktande
fotolack
foerfarande foer
foerfarande
foer
Prior art date
Application number
FI891740A
Other languages
English (en)
Other versions
FI891740A7 (fi
FI891740A0 (fi
Inventor
Hermann Buerk
Thomas Wagner
Michael Steinhauser
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI891740A0 publication Critical patent/FI891740A0/fi
Publication of FI891740A7 publication Critical patent/FI891740A7/fi
Publication of FI891740L publication Critical patent/FI891740L/fi

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
FI891740A 1988-04-13 1989-04-12 Foerfarande foer avskiktande av fotolack. FI891740L (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3812315 1988-04-13

Publications (3)

Publication Number Publication Date
FI891740A0 FI891740A0 (fi) 1989-04-12
FI891740A7 FI891740A7 (fi) 1989-10-14
FI891740L true FI891740L (fi) 1989-10-14

Family

ID=6351902

Family Applications (1)

Application Number Title Priority Date Filing Date
FI891740A FI891740L (fi) 1988-04-13 1989-04-12 Foerfarande foer avskiktande av fotolack.

Country Status (4)

Country Link
US (1) US4966664A (fi)
EP (1) EP0337342A1 (fi)
JP (1) JPH0212154A (fi)
FI (1) FI891740L (fi)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2226991A (en) * 1989-01-13 1990-07-18 Ibm Etching organic polymeric materials
US5186797A (en) * 1991-02-13 1993-02-16 Future Automation, Inc. Method and system for removing resin bleed from electronic components
US5318677A (en) * 1991-02-13 1994-06-07 Future Automation, Inc. Process and solutions for removing resin bleed from electronic components
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
KR100271138B1 (ko) * 1998-01-22 2001-03-02 윤덕용 잉크젯 프린트 헤드 및 그 제조 방법
US6203691B1 (en) 1998-09-18 2001-03-20 Hoffman Industries International, Ltd. Electrolytic cleaning of conductive bodies
US6734120B1 (en) * 1999-02-19 2004-05-11 Axcelis Technologies, Inc. Method of photoresist ash residue removal
US6436276B1 (en) * 1999-10-07 2002-08-20 Polyclad Laminates, Inc. Cathodic photoresist stripping process
US7220615B2 (en) * 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
DE10259363A1 (de) * 2002-12-18 2004-07-08 Siemens Ag Verfahren zum Entfernen von zumindest einem Oberflächenbereich eines Bauteils
DE10259364A1 (de) * 2002-12-18 2004-07-08 Siemens Ag Verfahren zum Entfernen von zumindest einem Oberflächenbereich eines Beuteils
US20050167284A1 (en) * 2004-01-30 2005-08-04 International Business Machines Corporation Electrolytic method for photoresist stripping
SG175559A1 (en) * 2006-09-25 2011-11-28 Advanced Tech Materials Compositions and methods for the removal of photoresist for a wafer rework application
US9683305B2 (en) * 2011-12-20 2017-06-20 Apple Inc. Metal surface and process for treating a metal surface
CN104409328B (zh) * 2014-11-21 2018-01-30 深圳市华星光电技术有限公司 掩膜板的清洗方法及清洗装置
JP7352301B2 (ja) * 2021-12-24 2023-09-28 ハニー化成株式会社 電着フォトレジスト塗膜の剥離方法
CN114273343A (zh) * 2022-01-18 2022-04-05 中国石油大学(华东) 一种原位电致气泡除污方法及应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3900337A (en) * 1974-04-05 1975-08-19 Ibm Method for stripping layers of organic material
JPS5141032A (ja) * 1974-10-04 1976-04-06 Jidosha Kiki Co Tomakunodenkaihakuriho
IT1125196B (it) * 1975-08-01 1986-05-14 Allied Chem Disassorbitore fotoresistivo privo di fenolo
DD220623B1 (de) * 1983-12-05 1987-07-01 Sangerhausen Maschf Verfahren zum entfernen gehaerteter kopierschichten von metalloberflaechen
JPH0721638B2 (ja) * 1986-07-18 1995-03-08 東京応化工業株式会社 基板の処理方法

Also Published As

Publication number Publication date
FI891740A7 (fi) 1989-10-14
FI891740A0 (fi) 1989-04-12
JPH0212154A (ja) 1990-01-17
US4966664A (en) 1990-10-30
EP0337342A1 (de) 1989-10-18

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MM Patent lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT