FI872193A0 - Foerfarande foer anslutning av halvledarelement till varandra och anordning foer utfoerande av foerfarandet. - Google Patents

Foerfarande foer anslutning av halvledarelement till varandra och anordning foer utfoerande av foerfarandet.

Info

Publication number
FI872193A0
FI872193A0 FI872193A FI872193A FI872193A0 FI 872193 A0 FI872193 A0 FI 872193A0 FI 872193 A FI872193 A FI 872193A FI 872193 A FI872193 A FI 872193A FI 872193 A0 FI872193 A0 FI 872193A0
Authority
FI
Finland
Prior art keywords
foer
halvledarelement
foerfarandet
anslutning
utfoerande
Prior art date
Application number
FI872193A
Other languages
English (en)
Other versions
FI872193A (fi
Inventor
Vyacheslav Gennadievich Sizov
Valery Alexandrovich Kalachev
Alexandr Anatolievich Gulyaev
Vitaly Georgievich Melnik
Zinovy Mikhalevich Slavinsky
Original Assignee
Vyacheslav Gennadievich Sizov
Valery Alexandrovich Kalachev
Alexandr Anatolievich Gulyaev
Vitaly Georgievich Melnik
Zinovy Mikhalevich Slavinsky
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vyacheslav Gennadievich Sizov, Valery Alexandrovich Kalachev, Alexandr Anatolievich Gulyaev, Vitaly Georgievich Melnik, Zinovy Mikhalevich Slavinsky filed Critical Vyacheslav Gennadievich Sizov
Priority to FI872193A priority Critical patent/FI872193A/fi
Publication of FI872193A0 publication Critical patent/FI872193A0/fi
Publication of FI872193A publication Critical patent/FI872193A/fi

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
FI872193A 1987-05-19 1987-05-19 Foerfarande foer anslutning av halvledarelement till varandra och anordning foer utfoerande av foerfarandet. FI872193A (fi)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FI872193A FI872193A (fi) 1987-05-19 1987-05-19 Foerfarande foer anslutning av halvledarelement till varandra och anordning foer utfoerande av foerfarandet.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI872193A FI872193A (fi) 1987-05-19 1987-05-19 Foerfarande foer anslutning av halvledarelement till varandra och anordning foer utfoerande av foerfarandet.

Publications (2)

Publication Number Publication Date
FI872193A0 true FI872193A0 (fi) 1987-05-19
FI872193A FI872193A (fi) 1988-11-20

Family

ID=8524506

Family Applications (1)

Application Number Title Priority Date Filing Date
FI872193A FI872193A (fi) 1987-05-19 1987-05-19 Foerfarande foer anslutning av halvledarelement till varandra och anordning foer utfoerande av foerfarandet.

Country Status (1)

Country Link
FI (1) FI872193A (fi)

Also Published As

Publication number Publication date
FI872193A (fi) 1988-11-20

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Legal Events

Date Code Title Description
FA Application withdrawn

Owner name: SIZOV, VYACHESLAV GENNADIEVICH

Owner name: GULYAEV, ALEXANDR ANATOLIEVICH

Owner name: SLAVINSKY, ZINOVY MIKHALEVICH

Owner name: KALACHEV, VALERY ALEXANDROVICH

Owner name: MELNIK, VITALY GEORGIEVICH