FI870723A0 - FOER TEMPERATURFOERAENDRINGAR UTSATT ANORDNING. - Google Patents

FOER TEMPERATURFOERAENDRINGAR UTSATT ANORDNING.

Info

Publication number
FI870723A0
FI870723A0 FI870723A FI870723A FI870723A0 FI 870723 A0 FI870723 A0 FI 870723A0 FI 870723 A FI870723 A FI 870723A FI 870723 A FI870723 A FI 870723A FI 870723 A0 FI870723 A0 FI 870723A0
Authority
FI
Finland
Prior art keywords
utsatt
temperaturfoeraendringar
anordning
foer
utsatt anordning
Prior art date
Application number
FI870723A
Other languages
Finnish (fi)
Other versions
FI83968B (en
FI870723A (en
FI83968C (en
Inventor
Herbert Prussas
Alfred Wimmer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI870723A0 publication Critical patent/FI870723A0/en
Publication of FI870723A publication Critical patent/FI870723A/en
Publication of FI83968B publication Critical patent/FI83968B/en
Application granted granted Critical
Publication of FI83968C publication Critical patent/FI83968C/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
FI870723A 1986-02-21 1987-02-20 FOER TEMPERATURFOERAENDRINGAR UTSATT ANORDNING. FI83968C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19863605692 DE3605692A1 (en) 1986-02-21 1986-02-21 TEMPERATURE CHANGES EXPOSED ARRANGEMENT
DE3605692 1986-02-21

Publications (4)

Publication Number Publication Date
FI870723A0 true FI870723A0 (en) 1987-02-20
FI870723A FI870723A (en) 1987-08-22
FI83968B FI83968B (en) 1991-06-14
FI83968C FI83968C (en) 1991-09-25

Family

ID=6294681

Family Applications (1)

Application Number Title Priority Date Filing Date
FI870723A FI83968C (en) 1986-02-21 1987-02-20 FOER TEMPERATURFOERAENDRINGAR UTSATT ANORDNING.

Country Status (4)

Country Link
EP (1) EP0236739A1 (en)
DE (1) DE3605692A1 (en)
FI (1) FI83968C (en)
ZA (1) ZA871252B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0268935B1 (en) * 1986-11-28 1991-12-18 Siemens Aktiengesellschaft Vertically pluggable single-in-line circuit module
DE3722119A1 (en) * 1987-07-03 1989-01-12 Siemens Ag CIRCUIT MODULE WITH A PLATE-SHAPED CIRCUIT BRACKET MADE OF GLASS OR CERAMIC
DE4217800C1 (en) * 1992-05-29 1994-01-05 Webasto Ag Fahrzeugtechnik Multipart adhesive bonding mould - has a lower section in a number of parts and a swing upper section to contain the high mass of components to be bonded

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU83439A1 (en) * 1980-09-25 1981-10-29 Siemens Ag HOUSELESS, VERTICAL PLUG-IN SINGLE-IN-LINE SWITCHING MODULE
DE3245553C2 (en) * 1982-12-09 1986-05-07 Compakta Werke Baustoff-GmbH, 8225 Traunreut Process for the permanent connection of structural parts

Also Published As

Publication number Publication date
DE3605692A1 (en) 1986-11-06
FI83968B (en) 1991-06-14
ZA871252B (en) 1987-09-30
FI870723A (en) 1987-08-22
FI83968C (en) 1991-09-25
EP0236739A1 (en) 1987-09-16

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Legal Events

Date Code Title Description
MM Patent lapsed
MM Patent lapsed

Owner name: SIEMENS AKTIENGESELLSCHAFT