FI853441L - AV KYLMEDIUM OMRINGAT ELASTISKT KYLSTYCKE. - Google Patents

AV KYLMEDIUM OMRINGAT ELASTISKT KYLSTYCKE.

Info

Publication number
FI853441L
FI853441L FI853441A FI853441A FI853441L FI 853441 L FI853441 L FI 853441L FI 853441 A FI853441 A FI 853441A FI 853441 A FI853441 A FI 853441A FI 853441 L FI853441 L FI 853441L
Authority
FI
Finland
Prior art keywords
omringat
kylstycke
kylmedium
elastiskt
omringat elastiskt
Prior art date
Application number
FI853441A
Other languages
Finnish (fi)
Other versions
FI853441A0 (en
Inventor
Herbert Prussas
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of FI853441A0 publication Critical patent/FI853441A0/en
Publication of FI853441L publication Critical patent/FI853441L/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FI853441A 1984-09-10 1985-09-09 AV KYLMEDIUM OMRINGAT ELASTISKT KYLSTYCKE. FI853441L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3433165 1984-09-10

Publications (2)

Publication Number Publication Date
FI853441A0 FI853441A0 (en) 1985-09-09
FI853441L true FI853441L (en) 1986-03-11

Family

ID=6245023

Family Applications (1)

Application Number Title Priority Date Filing Date
FI853441A FI853441L (en) 1984-09-10 1985-09-09 AV KYLMEDIUM OMRINGAT ELASTISKT KYLSTYCKE.

Country Status (2)

Country Link
EP (1) EP0174537A1 (en)
FI (1) FI853441L (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5205353A (en) * 1989-11-30 1993-04-27 Akzo N.V. Heat exchanging member
EP0471552B1 (en) * 1990-08-14 1997-07-02 Texas Instruments Incorporated Heat transfer module for ultra high density and silicon on silicon packaging applications
EP0510734A1 (en) * 1991-02-20 1992-10-28 Akzo Nobel N.V. Heat exchanging member, more particularly for cooling a semiconductor module

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1057241B (en) * 1955-12-12 1959-05-14 Siemens Ag Rectifier arrangement with semiconductor element
DE2460631C3 (en) * 1974-12-20 1979-04-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen Heat sink for external cooling of thyristors
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module

Also Published As

Publication number Publication date
FI853441A0 (en) 1985-09-09
EP0174537A1 (en) 1986-03-19

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Legal Events

Date Code Title Description
FA Application withdrawn

Owner name: SIEMENS AKTIENGESELLSCHAFT